Abstract: Provided is a photodetector which can be manufactured in a standard process of a mass-produced CMOS foundry. The photodetector includes a silicon (Si) substrate; a lower clad layer; a core layer including a waveguide layer configured to guide signal light, and including a first Si slab doped with first conductive impurity ions and a second Si slab doped with second conductive impurity ions; a germanium (Ge) layer configured to absorb light and including a Ge region doped with the first conductive impurity ions; an upper clad layer; and electrodes respectively connected to the first and second Si slabs and the Ge region. A region of the core layer sandwiched between the first Si slab and the second Si slab operates as an amplification layer.

Abstract: A method for screening multi-layered ceramic capacitors having internal defects at a high accuracy by superposing a direct-current constant current between external electrodes of a multi-layered ceramic capacitor having a defective part in an effective layer of the dielectric ceramic, raising the voltage between the external electrodes, and further feeding the direct-current constant current for a specific time after the voltage curve becomes flat, capacitors experiencing a sudden drop in the voltage between the external electrodes during the feeding time are sorted out and removed as a defective product.

Abstract: Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mounted on one surface of the thin metal plates (11) having the other surface which at least part serves as a plurality of external connecting terminals (11a) and, on one surface side, the integrated circuit element (12) is covererd with a sealing resin (15).

Abstract: A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.

Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Abstract: A hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one side of the substrate, and a pair of conductor layers formed along opposite sides of the substrate to serve as external connection terminals. Circuit elements are mounted on the substrate and electrically connected to the circuit conductor.

Abstract: An etchant comprising an electrolytic liquid which comprises sulfuric acid as a main component and water in such amount that the weight ratio of sulfuric acid to water is between 9:1 and 2:1. The ferrite surface having been electrolytically etched by using this etchant is smooth. Thus, this etchant makes it possible to etch a ferrite to a large depth, and thereby easily shape a ferrite by electrolytic etching, e.g. to define the track width of a magnetic head.