Patents by Inventor Tatsuro MATSUSHIMA

Tatsuro MATSUSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964342
    Abstract: A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: April 23, 2024
    Assignee: JSW AKTINA SYSTEM CO., LTD.
    Inventors: Teruaki Shimoji, Daisuke Ito, Tatsuro Matsushima, Ryo Shimizu
  • Patent number: 11676818
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: June 13, 2023
    Assignee: JSW AKTINA SYSTEM CO., LTD
    Inventors: Daisuke Ito, Tamotsu Odajima, Ryo Shimizu, Masashi Machida, Tatsuro Matsushima
  • Publication number: 20220152733
    Abstract: A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.
    Type: Application
    Filed: November 29, 2019
    Publication date: May 19, 2022
    Inventors: Teruaki SHIMOJI, Daisuke ITO, Tatsuro MATSUSHIMA, Ryo SHIMIZU
  • Patent number: 10943785
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: March 9, 2021
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Daisuke Ito, Tamotsu Odajima, Ryo Shimizu, Masashi Machida, Tatsuro Matsushima
  • Publication number: 20210066082
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Application
    Filed: October 22, 2020
    Publication date: March 4, 2021
    Inventors: Daisuke ITO, Tamotsu ODAJIMA, Ryo SHIMIZU, Masashi MACHIDA, Tatsuro MATSUSHIMA
  • Publication number: 20190198322
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Application
    Filed: July 14, 2017
    Publication date: June 27, 2019
    Inventors: Daisuke ITO, Tamotsu ODAJIMA, Ryo SHIMIZU, Masashi MACHIDA, Tatsuro MATSUSHIMA