Abstract: In a high-frequency module, an arrangement order of antenna terminals, transmission-side signal terminals, and reception-side signal terminals in a second direction corresponds to an arrangement order of antenna terminal electrodes, transmission-side terminal electrodes, and reception-side terminal electrodes in the second direction.

Abstract: A high-frequency module includes a mount board, a wave splitter chip mounted on one principal surface of the mount board and including a transmission filter and a reception filter, a first inductor chip mounted on one principal surface of the mount board and including an inductor, and a second inductor chip mounted on one principal surface of the mount board and including an inductor. The first and second inductor chips are disposed adjacent to each other and each has a polarity. The first and second inductor chips are disposed such that the polarities thereof are opposite to each other, as viewed from the reception filter.

Abstract: A high-frequency module includes a mount board, a wave splitter chip mounted on one principal surface of the mount board and including a transmission filter and a reception filter, a first inductor chip mounted on one principal surface of the mount board and including an inductor, and a second inductor chip mounted on one principal surface of the mount board and including an inductor. The first and second inductor chips are disposed adjacent to each other and each has a polarity. The first and second inductor chips are disposed such that the polarities thereof are opposite to each other, as viewed from the reception filter.

Abstract: In a high-frequency module, an arrangement order of antenna terminals, transmission-side signal terminals, and reception-side signal terminals in a second direction corresponds to an arrangement order of antenna terminal electrodes, transmission-side terminal electrodes, and reception-side terminal electrodes in the second direction.

Abstract: A duplexer module that is used for transmission and reception of a signal in at least two communication systems using different frequency bands includes a wiring board, dual transmission filters in a transmission filter unit that is provided on the wiring board and that includes a transmission filter, and dual reception filters in a reception filter unit that is provided on the wiring board and that includes a reception filter. Each of the dual reception filters includes at least two reception filters having different frequency bands, and the output side of the reception filters is shared between the reception filters such that a common output terminal is provided for the reception filters.

Abstract: A duplexer module that is used for transmission and reception of a signal in at least two communication systems using different frequency bands includes a wiring board, dual transmission filters in a transmission filter unit that is provided on the wiring board and that includes a transmission filter, and dual reception filters in a reception filter unit that is provided on the wiring board and that includes a reception filter. Each of the dual reception filters includes at least two reception filters having different frequency bands, and the output side of the reception filters is shared between the reception filters such that a common output terminal is provided for the reception filters.

Abstract: A surface acoustic wave filter includes a surface acoustic device on a reception side which has signal terminals for inputting and outputting located in a corner along a diagonal and a surface acoustic wave device on the transmission side which has signal terminals for inputting and outputting at ends on one side. The surface acoustic wave devices are provided on a circuit board such that the signal terminals are located close to each other and connected to a wiring pattern on the antenna side.

Abstract: A surface acoustic wave duplexer includes a branching section having a plurality of surface acoustic wave filters provided on a first electrode pattern on the front surface of a multi-layer substrate. An antenna terminal, a transmission terminal, and a receiving terminal are provided on peripheral portions of a fourth electrode pattern on the rear surface of the multi-layer substrate, and are connected to the branching section. A matching stripline disposed on a third electrode pattern in an intermediate layer of the multi-layer substrate, and connected to the antenna terminal is arranged such that it is grounded to at least one side other than the side opposite the side where the antenna terminal is located.

Abstract: A surface acoustic wave filter includes a surface acoustic device on a reception side which has signal terminals for inputting and outputting located in a corner along a diagonal and a surface acoustic wave device on the transmission side which has signal terminals for inputting and outputting at ends on one side. The surface acoustic wave devices are provided on a circuit board such that the signal terminals are located close to each other and connected to a wiring pattern on the antenna side.

Abstract: A surface acoustic wave duplexer includes a branching section having a plurality of surface acoustic wave filters provided on a first electrode pattern on the front surface of a multi-layer substrate. An antenna terminal, a transmission terminal, and a receiving terminal are provided on peripheral portions of a fourth electrode pattern on the rear surface of the multi-layer substrate, and are connected to the branching section. A matching stripline disposed on a third electrode pattern in an intermediate layer of the multi-layer substrate, and connected to the antenna terminal is arranged such that it is grounded to at least one side other than the side opposite the side where the antenna terminal is located.