Patents by Inventor Tatsurou Hirano

Tatsurou Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
    Patent number: 6221509
    Abstract: In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.
    Type: Grant
    Filed: April 14, 1999
    Date of Patent: April 24, 2001
    Assignees: Tatsumori Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsurou Hirano, Nobukazu Suzuki, Toshio Shiobara, Takayuki Aoki, Shoichi Osada