Patents by Inventor Tatsuru OKAMURA

Tatsuru OKAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250140590
    Abstract: Provided is a teaching method for teaching a transfer position of a consumable member in a cassette included in a substrate processing system, the substrate processing system having a transfer device configured to transfer the consumable member, and a storage module where the cassette accommodating a plurality of the consumable members is set; the teaching method comprising the steps of: (A) recognizing setting of the cassette in the storage module; and (B) after the step (A), detecting the cassette by a sensor of the transfer device and calculating three-dimensional coordinates of the cassette based on detection information of the sensor.
    Type: Application
    Filed: October 21, 2024
    Publication date: May 1, 2025
    Inventors: Toshiaki KODAMA, Tatsuru Okamura
  • Publication number: 20250046585
    Abstract: A substrate processing system according to an aspect of the present disclosure includes: a plurality of processors each including a substrate support supporting a substrate and a ring disposed around the substrate, a vacuum transferer connected to the processors, the vacuum transferer including a transfer robot for transferring the substrate or the ring, an accommodation for accommodating the ring, and a controller for executing control to remove all the substrates from the processors and the vacuum transferer, and after the removing, for executing control to transfer the ring between at least one of the processors and the accommodation.
    Type: Application
    Filed: October 25, 2024
    Publication date: February 6, 2025
    Applicant: Tokyo Electron Limited
    Inventors: Tatsuru OKAMURA, Masatomo KITA, Young tae SONG
  • Publication number: 20250046583
    Abstract: A substrate processing system disclosed here includes a vacuum transfer chamber, a plurality of substrate processing modules, a ring stocker, a transfer robot, and control circuitry. The plurality of substrate processing modules and the ring stocker are connected to the vacuum transfer chamber. When the transfer robot is transferring only a new edge ring using one of at least two end effectors, the controller controls the transfer robot to transfer a substrate via the vacuum transfer chamber using an unused end effector of the at least two end effectors in response to a substrate transfer request.
    Type: Application
    Filed: October 25, 2024
    Publication date: February 6, 2025
    Applicant: Tokyo Electron Limited
    Inventors: Tatsuru OKAMURA, Masatomo KITA, Young tae SONG
  • Publication number: 20250006533
    Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.
    Type: Application
    Filed: October 13, 2021
    Publication date: January 2, 2025
    Inventors: Wataru MATSUMOTO, Takehiro SHINDO, Tatsuru OKAMURA, Nanako SHINODA, Junpei SASAKI
  • Publication number: 20240222185
    Abstract: A substrate transfer system includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly includes a substrate processing chamber, a substrate support, and a first temperature sensor that measures a temperature of the substrate support. The substrate transfer assembly includes a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer includes a first end-effector that holds a high-temperature substrate, a second end-effector that holds a low-temperature substrate, and a deposit detector located adjacent to at least one of the end-effectors.
    Type: Application
    Filed: March 15, 2024
    Publication date: July 4, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Tatsuru OKAMURA, Norihiko AMIKURA, Masatomo KITA, Takehiro SHINDO
  • Publication number: 20220365187
    Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.
    Type: Application
    Filed: April 29, 2022
    Publication date: November 17, 2022
    Inventors: Toshiaki KODAMA, Shinji WAKABAYASHI, Takehiro SHINDO, Tatsuru OKAMURA