Abstract: A vehicular air conditioning device includes a blower, a heating heat exchanger, an auxiliary heater, and a blower controller. The heating heat exchanger heats blown air by exchanging heat between the blown air and the cooling water of the in-vehicle device emitting heat during operation. The blower controller is configured to control the operation of the blower. The blower controller is configured to increase a blowing capacity of the blower with increase of a temperature of the cooling water. The blower controller, during operation of the auxiliary heater, increases the blowing capacity after a waiting time during which the increase of the blowing capacity is prohibited has elapsed since a start-up switch of a vehicle system is turned on. The vehicular air conditioning is capable of implementing a quick warming of the in-vehicle device without impairing the heating feeling of occupant.

Abstract: A vehicular air-conditioning device includes a blowing port mode door as an air volume regulator that regulates volumes of air-conditioning air blown to a driver seat area, a front passenger seat area, and a rear seat area inside a vehicle compartment, and an air-conditioning controller activated by an activation signal outputted from a body controller in response to opening and closing of a rear seat door during a stoppage of a vehicle system. The air-conditioning controller is capable of operating an actuator for driving the blowing port mode door to blow the air-conditioning air to the rear seat area when an activation switch of the vehicle system is turned on in a state where the air-conditioning control unit has been activated by the activation signal.

Abstract: A vehicular air conditioning device includes a blower, a heating heat exchanger, an auxiliary heater, and a blower controller. The heating heat exchanger heats blown air by exchanging heat between the blown air and the cooling water of the in-vehicle device emitting heat during operation. The blower controller is configured to control the operation of the blower. The blower controller is configured to increase a blowing capacity of the blower with increase of a temperature of the cooling water. The blower controller, during operation of the auxiliary heater, increases the blowing capacity after a waiting time during which the increase of the blowing capacity is prohibited has elapsed since a start-up switch of a vehicle system is turned on. The vehicular air conditioning is capable of implementing a quick warming of the in-vehicle device without impairing the heating feeling of occupant.

Abstract: A vehicular air-conditioning device includes a blowing port mode door as an air volume regulator that regulates volumes of air-conditioning air blown to a driver seat area, a front passenger seat area, and a rear seat area inside a vehicle compartment, and an air-conditioning controller activated by an activation signal outputted from a body controller in response to opening and closing of a rear seat door during a stoppage of a vehicle system. The air-conditioning controller is capable of operating an actuator for driving the blowing port mode door to blow the air-conditioning air to the rear seat area when an activation switch of the vehicle system is turned on in a state where the air-conditioning control unit has been activated by the activation signal.

Abstract: A cryogenic dynamic cooling apparatus and a cooling method for heat assisted magnetic recording media substrate are provided. The cooling apparatus includes a chamber that is configured to receive a substrate. A substrate holder secures the substrate inside the chamber. The apparatus has a cooling plate that is movable between a retracted position and an extended position inside the chamber. The cooling plate provides clearance for movement of the substrate holder inside the chamber in the retracted position, and the cooling plate cools the substrate in the extended position. Also, the cooling plate is substantially parallel to and spaced apart from the substrate. The apparatus further includes a cryogenic operatively coupled to the cooling plate that is cooled by the cryogenic cooling element.

Abstract: Aspects of the present invention are directed to a cryogenic dynamic cooling apparatus and a cooling method for heat assisted magnetic recording media substrate. The cooling apparatus includes a chamber that is configured to receive a substrate. A substrate holder secures the substrate inside the chamber. The apparatus has a cooling plate that is movable between a retracted position and an extended position inside the chamber. The cooling plate provides clearance for movement of the substrate holder inside the chamber in the retracted position, and the cooling plate cools the substrate in the extended position. Also, the cooling plate is substantially parallel to and spaced apart from the substrate. The apparatus further includes a cryogenic cooling element operatively coupled to the cooling plate that is cooled by the cryogenic cooling element.

Abstract: A cathode sputtering source comprises a heat sink comprising a substantially circularly-shaped planar disk formed of an electrically and thermally conductive material, with a circumferentially extending edge connecting first and second opposing major surfaces, the first major surface including a plurality of radially extending, recessed gas supply channels formed therein and extending from a central recess formed in the first major surface to the circumferentially extending edge; the second major surface including a gas inlet formed adjacent the circumferentially extending edge; a gas flow channel formed in the interior of the disk fluidly connects the gas inlet and central recess; and a substantially circular disk-shaped sputtering target is mounted on the first major surface, whereby gas supplied to the gas inlet is substantially uniformly distributed around the entirety of the circumferentially extending edge of the heat sink.

Abstract: An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.

Abstract: Systems and methods for uniformly implanting materials on substrates using directed magnetic fields are provided. One such system includes a chamber configured to receive a preselected material and to enclose a first substrate, first and second rotating assemblies configured to facilitate an implantation of the preselected material onto first and second surfaces of the first substrate and including first and second rotating magnet sub-assemblies configured to direct magnetic fields onto the first and second surfaces, and an RF energizer configured to apply RF energy to the first substrate, where the first magnetic field and the second magnetic field combine to form a resultant magnetic field that is substantially parallel along the first surface, and where the implantation of the preselected material onto the first substrate occurs based on a combination of the RF energy and the resultant magnetic field.

Abstract: A disk processing system having a heater chamber and dual single-sided sputter chambers each with a sustaining heater.

Abstract: Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.

Abstract: Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.

Abstract: A method of sputter depositing a substantially circumferentially uniform thin film on a surface of a circular, planar disk-shaped substrate, comprising steps of: (a) providing a cathode sputtering apparatus including: a vacuum chamber; a cathode sputtering source comprising a circularly-shaped sputtering target assembly with a first target having a planar sputtering surface and a circumferentially extending edge; and a circular disk-shaped substrate with a planar surface positioned in spaced opposition to the sputtering surface; and (b) sputter depositing the thin film on the substrate surface while providing the chamber with a substantially uniform flow of at least one process gas around the entirety of the circumferentially extending edge of the sputtering target assembly.

Abstract: A cathode sputtering source comprises a heat sink comprising a substantially circularly-shaped planar disk formed of an electrically and thermally conductive material, with a circumferentially extending edge connecting first and second opposing major surfaces, the first major surface including a plurality of radially extending, recessed gas supply channels formed therein and extending from a central recess formed in the first major surface to the circumferentially extending edge; the second major surface including a gas inlet formed adjacent the circumferentially extending edge; a gas flow channel formed in the interior of the disk fluidly connects the gas inlet and central recess; and a substantially circular disk-shaped sputtering target is mounted on the first major surface, whereby gas supplied to the gas inlet is substantially uniformly distributed around the entirety of the circumferentially extending edge of the heat sink.

Abstract: Apparatus for exposing at least one substrate/workpiece to a gas atmosphere under preselected pressure and temperature conditions, comprising: (a) a chamber defining an interior space and provided with inlet and outlet means at opposite ends thereof; (b) vacuum means for evacuating the interior space and including valve means for controlling the evacuating; (c) a pair of opposingly facing gas injection means in the interior space and defining an intermediate space therebetween for accommodating the at least one substrate/workpiece during transport through the chamber, each of the gas injection means including means for controlling the temperature thereof; (d) gas supply means for supplying the pair of gas injection means with a flow of a preselected gas and including valve means for controlling the gas flow; and (e) transport means for transporting the at least one substrate/workpiece through the interior space of said chamber via the intermediate space between the opposingly facing gas injection means.

Abstract: An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.

Abstract: A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system configuration. A dual processing module, including first and second process stations, is selectably operable in a serial mode or a parallel mode.