Abstract: Provided is a surface-emitting element in which a configuration can be simplified and an emission wavelength is not restricted by a substrate used at the time of manufacturing. A surface-emitting element according to the present technology is a surface-emitting element including at least one light emitting element portion that includes at least one organic semiconductor layer and a concave mirror arranged on one side of the organic semiconductor layer. According to the surface-emitting element of the present technology, it is possible to provide a surface-emitting element in which the configuration can simplified and the emission wavelength is not restricted by the substrate used at the time of manufacturing.

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: [Solving Means] A vertical cavity surface emitting laser device according to the present technology includes: a semiconductor layer; a substrate; a first mirror; and a second mirror. The semiconductor layer includes an active layer formed of a first material. The substrate is bonded to the semiconductor layer, is formed of a second material having bandgap energy higher than that of the first material, and causes light of a specific wavelength to be transmitted therethrough. The first mirror is provided on a side of the semiconductor layer opposite to the substrate, and reflects the light of a specific wavelength. The second mirror is provided on a side of the substrate opposite to the semiconductor layer, and reflects the light of a specific wavelength.

Abstract: To provide a semiconductor light-emitting device that has excellent productivity and is capable of aligning a current injection region and a lens with high accuracy, and a method of producing the semiconductor light-emitting device. A method of producing a light-emitting device according to the present technology includes: forming a light-blocking structure that is a structure opaque to an exposure wavelength on a side of a first main surface of a substrate having the first main surface and a second main surface on a side opposite to the first main surface; forming a photosensitive layer that is formed of a photosensitive material on a side of the second main surface of the substrate; applying light having the exposure wavelength to the substrate from the side of the first main surface and forming the photosensitive layer into a pattern corresponding to the light-blocking structure; and forming a lens using the photosensitive layer.

Abstract: Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

Abstract: Provided is a resin material capable of suppressing warpage of a cured product and shortening the baking time. The resin material according to the present invention contains a thermosetting compound that does not have an aromatic ring in a structural portion excluding a thermosetting functional group, has two or more CH3 terminals in a structural portion excluding a thermosetting functional group, and satisfies the following formula (X); and an inorganic filler, the resin material having a content of the inorganic filler of 30 wt % or more in 100 wt % of components excluding a solvent in the resin material: 0.1?A/(B×C)?0.6 . . . Expression (X) A: number of CH3 terminals of a structural portion excluding a thermosetting functional group of the thermosetting compound, B: number of thermosetting functional groups of the thermosetting compound, and C: number of carbon atoms of a structural portion excluding a thermosetting functional group of the thermosetting compound.

Abstract: Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.

Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.

Abstract: There is provided a resin composition with which the desmear properties can be enhanced, a cured product thereof can be made low in dielectric loss tangent, and the cured product can be made high in heat resistance.

Abstract: Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa·s or less at 25° C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound.

Abstract: A manufacturing method of a multilayer substrate uses a multilayer insulation film which includes a first insulation layer and a second insulation layer laminated on one surface of the first insulation layer, the second insulation layer being configured such that, in partially removing the second insulation layer, only the second insulation layer is enabled to be selectively removed to form a groove having a depth equal to a thickness of the second insulation layer on an obtained insulation layer. The manufacturing method includes: laminating the multilayer insulation film on a surface of a circuit board; selectively and partially removing only the second insulation layer out of the first insulation layer and the second insulation layer to form the groove having a depth equal to the thickness of the second insulation layer on the obtained insulation layer; and forming metal wiring within the groove formed on the insulation layer.

Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.

Abstract: A manufacturing method of a multilayer substrate uses a multilayer insulation film which includes a first insulation layer and a second insulation layer laminated on one surface of the first insulation layer, the second insulation layer being configured such that, in partially removing the second insulation layer, only the second insulation layer is enabled to be selectively removed to form a groove having a depth equal to a thickness of the second insulation layer on an obtained insulation layer. The manufacturing method includes: laminating the multilayer insulation film on a surface of a circuit board; selectively and partially removing only the second insulation layer out of the first insulation layer and the second insulation layer to form the groove having a depth equal to the thickness of the second insulation layer on the obtained insulation layer; and forming metal wiring within the groove formed on the insulation layer.

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract: An optical unit including a lens and a mirror unit installed within an image forming apparatus, the lens and mirror unit moving together according to a desired power of magnification so as to expose a photoconductor to the light reflected from the original to form an image corresponding to the desired magnification, wherein the optical unit includes a cam device for moving the mirror unit, the cam device including a cam which is connected to a driving source and rotates according to the various power of magnification, and a cam follower which moves around the cam to reciprocate the mirror unit; and a lock means on the circumferential surface of the cam, the lock means engaging the cam follower to prevent the mirror unit from moving when a specific variable power of magnification is selected.

Abstract: An image reading apparatus is provided with a transparent plate horizontally disposed on which an image reading operation is performed, and a transporting device disposed above the transparent plate for transporting an original sheet to the transparent plate. The transporting device includes a pressure roller for pressing the original sheet onto an upper surface of the transparent plate at a pressure applying position and transporting the original sheet along the upper surface of the transparent plate. The image reading apparatus is also provided with a light source disposed below the transparent plate for illuminating through the transparent plate a portion of the transported original sheet. The illuminated portion of the original sheet is positioned on the upper surface of the transparent plate at an upstream side of the pressure applying position with respect to a transporting direction of the original sheet.