Patents by Inventor Tatsushi SHIMADA

Tatsushi SHIMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11085143
    Abstract: Disclosed herein is a heat pump type dryer for reducing the manufacturing cost thereof and maintaining an appropriate quantity of radiation by auxiliary heat exchanger. The clothes dryer D includes housing 1; drum portion 2 installed in the housing 1 and configured to accommodate clothes; a circulation ventilation path 3 configured to pass through the drum portion 2; a heat pump apparatus 5 having a compressor 52, a condenser 53, a throttling device 54, and an evaporator 51, connected to form a flow path through which refrigerant circulates; an auxiliary heat exchanger 55 installed outside the ventilation path, and connected in series to a flow path in the condenser 53 or in parallel to the condenser 53; and a cooling apparatus 6 configured to cool the auxiliary heat exchanger 55.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eiji Wakizaka, Susumu Kitamura, Naoki Kitayama, Tatsushi Shimada
  • Publication number: 20170314181
    Abstract: Disclosed herein is a heat pump type dryer for reducing the manufacturing cost thereof and maintaining an appropriate quantity of radiation by auxiliary heat exchanger. The clothes dryer D includes housing 1; drum portion 2 installed in the housing 1 and configured to accommodate clothes; a circulation ventilation path 3 configured to pass through the drum portion 2; a heat pump apparatus 5 having a compressor 52, a condenser 53, a throttling device 54, and an evaporator 51, connected to form a flow path through which refrigerant circulates; an auxiliary heat exchanger 55 installed outside the ventilation path, and connected in series to a flow path in the condenser 53 or in parallel to the condenser 53; and a cooling apparatus 6 configured to cool the auxiliary heat exchanger 55.
    Type: Application
    Filed: November 19, 2015
    Publication date: November 2, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eiji WAKIZAKA, Susumu KITAMURA, Naoki KITAYAMA, Tatsushi SHIMADA