Abstract: A moisture control material comprises a salt composed of a specific triazolium cation and a phosphate ester anion.

Abstract: An electronic component includes a terminal area and a solder member provided on the terminal area. The solder member includes a joint site that is joined to the terminal area, and a non-joint site that is not joined to the terminal area.

Abstract: The present invention relates to an ophthalmic composition for suppressing eye dryness, comprising at least one selected from the group consisting of chondroitin sulfate having a weight average molecular weight of 30,000 to 50,000 and a salt thereof.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: The expression data of specimen genes are processed using the SWEEP operator method and the parameter increasing method, and genes are selected. A FNN model is constructed by making the expression data of the selected genes as input variables.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: The expression data of specimen genes are processed using the SWEEP operator method and the parameter increasing method, and genes are selected. A FNN model is constructed by making the expression data of the selected genes as input variables.

Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.

Abstract: A linear actuator including a mechanism for preventing accidental drop of an inner cylinder caused when a driven nut engaged with a drive screw shaft is broken. The drop prevention mechanism includes a drop prevention nut threaded with the drive screw shaft in close proximity to the driven nut, a shear pin secured at one end to one of the drop prevention nut and the inner cylinder or the driven nut, and a shear pin guide groove formed in the other of the drop prevention nut and the inner cylinder or the driven nut for slidably receiving a projecting free end portion of the shear. When the inner cylinder and the driven nut is displaced in a direction of a load acting on the inner cylinder, the shear pin is broken or sheared by engagement with an end wall of the shear pin guide groove. Upon shearing of the shear pin, the drop prevention nut supports thereon the inner cylinder or the driven nut to thereby keep the inner cylinder in position against drop.

Abstract: A speaker apparatus has a damper for supporting vibrating elements including a vibrating diaphragm. The damper is formed by injecting a predetermined amount of a resin material into a metal mold of an injection molding equipment.

Abstract: A cylindrical frame is mounted in a cabinet and a magnetic circuit is provided at an end of the frame. A diaphragm having a peripheral free edge is connected to a coil bobbin and a cylindrical ring is secured to the free end edge and disposed in a cylindrical supporting portion of the frame. An annular sealing member is secured to the cylindrical ring so that an outside peripheral wall thereof is slidably contacted with an inside wall of the cylindrical supporting portion of the frame.