Patents by Inventor Tatsuya Ando
Tatsuya Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250099913Abstract: A moisture control material including a salt composed of a pyrazolium cation represented by the formula (N1) and a phosphate ester anion. In formula (N1), RN1, RN2, RN3, RN4 and RN5 are each independently a hydrogen atom, or an alkyl group having 1 to 12 carbon atoms which optionally has a hydroxy group and optionally includes one or more oxygen atoms in the chain. One or more of RN1 and RN2 which are substituents on a nitrogen atom that constitutes a 5-membered ring are alkyl groups having 1 to 12 carbon atoms, which optionally have a hydroxy group and optionally include one or more oxygen atoms in the chain.Type: ApplicationFiled: December 11, 2024Publication date: March 27, 2025Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Toshiyuki ITOH, Ryo INOUE, Shuji IKEGAMI, Tatsuya ANDO
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Publication number: 20250106610Abstract: A U2N relay (110 #2) transmits a first sidelink discovery message containing base-station identification information of a base station (130) when the U2N relay (110 #2) is in communication range with the base station (130). When a U2U relay (110 #3) is in communication range with the U2N relay (110 #2) and not in communication range with the base station (130), the U2U relay (110 #3) receives the first sidelink discovery message and transmits a second sidelink discovery message containing mobile-terminal-device identification information of the U2N relay (110 #2) and base-station identification the information. When a remote UE (110 #1) is in communication range with the U2U relay (110 #3) and no in communication range with the base station (130) and the U2N relay (110 #2), the remote UE (110 #1) receives the second sidelink discovery message and establishes communication path to communicate with the base station (130) via the U2U relay (110 #3) and the U2N relay (110 #2).Type: ApplicationFiled: December 6, 2021Publication date: March 27, 2025Applicant: Mitsubishi Electric CorporationInventors: Naofumi IWAYAMA, Mitsuru MOCHIZUKI, Tadahiro SHIMODA, Fumiki HASEGAWA, Shinya MAKINO, Nobuhiko ANDO, Tatsuya TOKUDA, Masayuki NAKAZAWA, Masuo ITO
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Publication number: 20250079229Abstract: A wafer placement table includes: a ceramic substrate that has a wafer placement surface at an upper surface of the ceramic substrate; an electrode that is incorporated in the ceramic substrate; and an electrically conductive electrode extraction portion that is incorporated in the ceramic substrate and is electrically connected to the electrode. A volume content percentage of a ceramic material that is identical to a main component of the ceramic substrate is high in the electrode extraction portion compared with the electrode.Type: ApplicationFiled: February 22, 2024Publication date: March 6, 2025Applicant: NGK INSULATORS, LTD.Inventors: Seiya INOUE, Tatsuya KUNO, Shinya YOSHIDA, Takahiro ANDO
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Publication number: 20240367146Abstract: A moisture control material comprises a salt composed of a specific triazolium cation and a phosphate ester anion.Type: ApplicationFiled: July 15, 2024Publication date: November 7, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Toshiyuki ITOH, Ryo Inoue, Tatsuya Ando, Shuji Ikegami
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Publication number: 20240047154Abstract: An electronic component includes a terminal area and a solder member provided on the terminal area. The solder member includes a joint site that is joined to the terminal area, and a non-joint site that is not joined to the terminal area.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Inventors: Kunio DORO, Tatsuya ANDO
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Publication number: 20230172969Abstract: The present invention relates to an ophthalmic composition for suppressing eye dryness, comprising at least one selected from the group consisting of chondroitin sulfate having a weight average molecular weight of 30,000 to 50,000 and a salt thereof.Type: ApplicationFiled: March 31, 2021Publication date: June 8, 2023Applicant: Rohto Pharmaceutical Co., Ltd.Inventors: Tatsuya Ando, Yoko Mitsuguchi, Sachiko Matsumoto, Atsuko Nakata
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Patent number: 8105856Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: GrantFiled: June 28, 2004Date of Patent: January 31, 2012Assignee: Semiconductor Components Industries, LLCInventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Patent number: 7312521Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: GrantFiled: April 23, 2003Date of Patent: December 25, 2007Assignee: Sanyo Electric Co., Ltd.Inventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Patent number: 7271466Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: GrantFiled: August 18, 2005Date of Patent: September 18, 2007Assignee: Sanyo Electric Co., Ltd.Inventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Publication number: 20060033198Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: ApplicationFiled: August 18, 2005Publication date: February 16, 2006Applicant: Sanyo Electric Co., Ltd.Inventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Patent number: 6980974Abstract: The expression data of specimen genes are processed using the SWEEP operator method and the parameter increasing method, and genes are selected. A FNN model is constructed by making the expression data of the selected genes as input variables.Type: GrantFiled: December 18, 2002Date of Patent: December 27, 2005Assignee: Nagoya Industrial Science Research InstituteInventors: Takeshi Kobayashi, Hiroyuki Honda, Taizo Hanai, Tatsuya Ando
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Publication number: 20040235270Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: ApplicationFiled: June 28, 2004Publication date: November 25, 2004Applicant: Sanyo Electric Co., Ltd.Inventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Publication number: 20030233196Abstract: The expression data of specimen genes are processed using the SWEEP operator method and the parameter increasing method, and genes are selected. A FNN model is constructed by making the expression data of the selected genes as input variables.Type: ApplicationFiled: December 18, 2002Publication date: December 18, 2003Applicant: NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTEInventors: Takeshi Kobayashi, Hiroyuki Honda, Taizo Hanai, Tatsuya Ando
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Publication number: 20030230805Abstract: Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.Type: ApplicationFiled: April 23, 2003Publication date: December 18, 2003Applicant: Sanyo Electric Co., Ltd.Inventors: Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Katsuhiko Kitagawa, Ryoji Tokushige, Takayasu Otagaki, Tatsuya Ando, Mitsuru Okigawa
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Patent number: 6234034Abstract: A linear actuator including a mechanism for preventing accidental drop of an inner cylinder caused when a driven nut engaged with a drive screw shaft is broken. The drop prevention mechanism includes a drop prevention nut threaded with the drive screw shaft in close proximity to the driven nut, a shear pin secured at one end to one of the drop prevention nut and the inner cylinder or the driven nut, and a shear pin guide groove formed in the other of the drop prevention nut and the inner cylinder or the driven nut for slidably receiving a projecting free end portion of the shear. When the inner cylinder and the driven nut is displaced in a direction of a load acting on the inner cylinder, the shear pin is broken or sheared by engagement with an end wall of the shear pin guide groove. Upon shearing of the shear pin, the drop prevention nut supports thereon the inner cylinder or the driven nut to thereby keep the inner cylinder in position against drop.Type: GrantFiled: September 15, 1999Date of Patent: May 22, 2001Assignee: Tsubakimoto Chain Co.Inventor: Tatsuya Ando
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Patent number: 6144753Abstract: A speaker apparatus has a damper for supporting vibrating elements including a vibrating diaphragm. The damper is formed by injecting a predetermined amount of a resin material into a metal mold of an injection molding equipment.Type: GrantFiled: May 19, 1997Date of Patent: November 7, 2000Assignee: Pioneer Electronic CorporationInventors: Takashi Ohyaba, Shunichi Takahashi, Showichiro Terauchi, Takanobu Saito, Tatsuya Ando, Yoshiya Usami, Hiroyuki Kataoka
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Patent number: 5848173Abstract: A cylindrical frame is mounted in a cabinet and a magnetic circuit is provided at an end of the frame. A diaphragm having a peripheral free edge is connected to a coil bobbin and a cylindrical ring is secured to the free end edge and disposed in a cylindrical supporting portion of the frame. An annular sealing member is secured to the cylindrical ring so that an outside peripheral wall thereof is slidably contacted with an inside wall of the cylindrical supporting portion of the frame.Type: GrantFiled: March 28, 1996Date of Patent: December 8, 1998Assignee: Pioneer Electronic CorporationInventors: Yoko Sato, Satoshi Kumada, Ziging Zhang, Junko Oba, Shinji Koyano, Takashi Morishige, Kohshiro Kogure, Yuichi Mohri, Tomohiro Suenaga, Shouichiro Terauchi, Tatsuya Ando, Takanobu Saito, Takashi Ohyaba, Shunichi Takahashi, Teruo Baba