Patents by Inventor Tatsuya Anzai

Tatsuya Anzai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8344599
    Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: January 1, 2013
    Assignee: Seiko Epson Corporation
    Inventors: Yoji Nagano, Tatsuya Anzai, Hideo Tanaya
  • Publication number: 20120025673
    Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
    Type: Application
    Filed: October 13, 2011
    Publication date: February 2, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yoji NAGANO, Tatsuya Anzai, Hideo Tanaya
  • Patent number: 8069549
    Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: December 6, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Yoji Nagano, Tatsuya Anzai, Hideo Tanaya
  • Patent number: 7928635
    Abstract: A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: April 19, 2011
    Assignee: Epson Toyocom Corporation
    Inventors: Yoji Nagano, Hideo Tanaya, Tatsuya Anzai
  • Publication number: 20090174291
    Abstract: A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
    Type: Application
    Filed: January 5, 2009
    Publication date: July 9, 2009
    Applicant: Epson Toyocom Corporation
    Inventors: Yoji NAGANO, Hideo TANAYA, Tatsuya ANZAI
  • Publication number: 20080231145
    Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 25, 2008
    Applicant: EPSON TOYOCOM CORPORATION
    Inventors: Yoji NAGANO, Tatsuya ANZAI, Hideo TANAYA
  • Patent number: 7183125
    Abstract: To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: February 27, 2007
    Assignee: Toyo Communication Equipment Co., Ltd.
    Inventors: Tatsuya Anzai, Yuji Ogawa, Yasuhide Onozawa
  • Publication number: 20060150381
    Abstract: To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device.
    Type: Application
    Filed: June 1, 2004
    Publication date: July 13, 2006
    Applicant: Toyo Communication Equipment Co., Ltd.
    Inventors: Tatsuya Anzai, Yuji Ogawa, Yasuhide Onozawa