Abstract: The present invention includes an imager, a cable that coats a cable core wire for performing at least one of inputting and outputting of signals between the imager and outside and supply of power to the imager from the outside, a first substrate that connects the imager to a first surface, and a second substrate that is connected to a first connection part different from a connection position of the imager on a second surface opposite to the first surface of the first substrate. In the cable core wire, relative to the second surface of the first substrate, at least part of a second connection part connected to the second substrate is positioned on a side opposite to a direction in which an image capturing surface of the imager is directed.

Abstract: An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.

Abstract: An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.