Patents by Inventor Tatsuya GANBE
Tatsuya GANBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10381154Abstract: A transformer is configured to include a pair of cores that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores are inserted and that is hermetically sealed with resin material, and a secondary winding that has a hollow into which the inner legs of the cores are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring are dispersedly arranged over the inner legs of the cores.Type: GrantFiled: May 1, 2017Date of Patent: August 13, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventors: Takeshi Watanabe, Kenji Okamoto, Tatsuya Ganbe
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Patent number: 10302566Abstract: A method evaluates the mobility of a polymer composition in a high-temperature region of 150° C. or above. The method for evaluating a physical property of a polymer composition, the method comprising the steps of: obtaining a thin film sample which is formed on a substrate and which comprises: a fluorescent probe including a fluorescent rare earth complex having a melting point of 200° C. or higher; and a target polymer composition; and obtaining a relationship between a temperature and a fluorescent characteristic of the thin film.Type: GrantFiled: May 8, 2015Date of Patent: May 28, 2019Assignees: Kyushu University, Fuji Electric Co., Ltd.Inventors: Keiji Tanaka, Daisuke Kawaguchi, Atsuomi Shundo, Mika Aoki, Tatsuya Ganbe, Nobuyuki Sekine, Kenji Okamoto
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Publication number: 20170365400Abstract: A transformer is configured to include a pair of cores that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores are inserted and that is hermetically sealed with resin material, and a secondary winding that has a hollow into which the inner legs of the cores are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring are dispersedly arranged over the inner legs of the cores.Type: ApplicationFiled: May 1, 2017Publication date: December 21, 2017Applicant: FUJI ELECTRIC CO., LTD.Inventors: Takeshi WATANABE, Kenji OKAMOTO, Tatsuya GANBE
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Patent number: 9643285Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.Type: GrantFiled: October 8, 2014Date of Patent: May 9, 2017Assignees: FUJI ELECTRIC CO., LTD., FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO., LTD.Inventors: Tatsuya Ganbe, Kenji Okamoto
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Publication number: 20160332262Abstract: Provided is flux composition for a solder, which thermally cures so as to cover and reinforce a solder ball during solder ball bonding. Employed is a flux for soldering, containing an epoxy resin, an organocarboxylic acid containing at least 0.1-40 mass % of a dicarboxylic acid having molecular weight of 180 or less, and a thixotropy-imparting agent, the epoxy resin and the organocarboxylic acid being blended such that there is 0.8-2.0 eq of the carboxyl groups of the organocarboxylic acid per 1.0 eq of the epoxy groups of the epoxy resin, and the epoxy resin, the organocarboxylic acid, and the thixotropy-imparting agent being contained in a total amount of 70 mass % or more relative to the total amount of the flux.Type: ApplicationFiled: January 28, 2015Publication date: November 17, 2016Applicant: FUJI ELECTRIC CO., LTD.Inventors: Ikuo SHOHJI, Tatsuya GANBE, Hirohiko WATANABE
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Publication number: 20160282267Abstract: A method evaluates the mobility of a polymer composition in a high-temperature region of 150° C. or above. The method for evaluating a physical property of a polymer composition, the method comprising the steps of: obtaining a thin film sample which is formed on a substrate and which comprises: a fluorescent probe including a fluorescent rare earth complex having a melting point of 200° C. or higher; and a target polymer composition; and obtaining a relationship between a temperature and a fluorescent characteristic of the thin film.Type: ApplicationFiled: May 8, 2015Publication date: September 29, 2016Applicants: Kyushu University, Fuji Electric Co., Ltd.Inventors: Keiji Tanaka, Daisuke Kawaguchi, Atsuomi Shundo, Mika Aoki, Tatsuya Ganbe, Nobuyuki Sekine, Kenji Okamoto
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Patent number: 9051450Abstract: A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.Type: GrantFiled: January 10, 2013Date of Patent: June 9, 2015Assignee: FUJI ELECTRIC CO., LTD.Inventors: Tatsuya Ganbe, Yuji Takematsu, Kenji Okamoto
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Publication number: 20150044465Abstract: A flux for resin cored solder containing a thermosetting resin is disclosed which is excellent in storage stability and productivity, and a resin cored solder having the flux built in. The flux for resin cored solder comprises a solid-state first flux containing a thermosetting resin, and a solid-state second flux containing a curing agent having redox activity, the first flux and the second flux being present in a non-contact state. A resin cored solder comprises the flux for resin cored solder and a lead-free solder alloy having a melting point ranging from 130° C. to 250° C. The resin cored solder is made up of a first resin cored solder in which the first flux is built into the lead-free solder alloy, and a second resin cored solder in which the second flux is built into the lead-free solder alloy.Type: ApplicationFiled: July 14, 2014Publication date: February 12, 2015Inventors: Tatsuya GANBE, Hirohiko WATANABE
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Publication number: 20150020923Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.Type: ApplicationFiled: October 8, 2014Publication date: January 22, 2015Inventors: Tatsuya GANBE, Kenji OKAMOTO
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Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
Patent number: 8492909Abstract: An insulating member of the invention can include an epoxy resin, a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 ?m. The first and second inorganic fillers can be independent of each other, and can be selected from a group including Al2O3, SiO2, BN, AlN, and Si3N4, and the blending ratios of the first and second inorganic fillers in the insulating member can be 0.1 to 7% by weight and 80 to 95% by weight respectively. A metal base substrate can be formed by forming a metal foil and a metal base on either surface of the insulating member.Type: GrantFiled: June 16, 2011Date of Patent: July 23, 2013Assignee: Fuji Electric Co., Ltd.Inventors: Kenji Okamoto, Tatsuya Ganbe -
INSULATING MEMBER, METAL BASE SUBSTRATE, AND SEMICONDUCTOR MODULE, AND MANUFACTURING METHODS THEREOF
Publication number: 20110309527Abstract: An insulating member of the invention can include an epoxy resin, a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 ?m. The first and second inorganic fillers can be independent of each other, and can be selected from a group including Al2O3, SiO2, BN, AIN, and Si3N4, and the blending ratios of the first and second inorganic fillers in the insulating member can be 0.1 to 7% by weight and 80 to 95% by weight respectively. A metal base substrate can be formed by forming a metal foil and a metal base on either surface of the insulating member.Type: ApplicationFiled: June 16, 2011Publication date: December 22, 2011Applicant: FUJI ELECTRIC CO., LTD.Inventors: Kenji OKAMOTO, Tatsuya GANBE