Patents by Inventor Tatsuya Hikida

Tatsuya Hikida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110114228
    Abstract: An aluminum alloy extruded product exhibiting excellent surface properties, contains 0.8 to 1.6% of Mn and 0.4 to 0.8% of Si at a ratio of Mn content to Si content (Mn %/Si %) of 0.7 to 2.4, with the balance being Al and inevitable impurities, the number of intermetallic compounds with a diameter (circle equivalent diameter) of 0.1 to 0.9 ?m dispersed in a matrix being 2×105 or more per square millimeter. The aluminum alloy extruded product allows extrusion of a thin multi-port tube at a high limiting extrusion rate, prevents deposits from adhering to the surface of the extruded tube, and may be suitably used as a constituent member for an aluminum alloy automotive heat exchanger.
    Type: Application
    Filed: January 18, 2011
    Publication date: May 19, 2011
    Inventors: Tomohiko Nakamura, Masaaki Kawakubo, Yoshiharu Hasegawa, Naoki Yamashita, Tatsuya Hikida
  • Patent number: 7767042
    Abstract: A high-strength aluminum alloy extruded product for heat exchangers which excels in extrudability, allows a thin flat multi-cavity tube to be extruded at a high critical extrusion rate, and excels in intergranular corrosion resistance at a high temperature, and a method of manufacturing the same. The aluminum alloy extruded product includes an aluminum alloy including 0.2 to 1.8% of Mn and 0.1 to 1.2% of Si, having a ratio of Mn content to Si content (Mn %/Si %) of 0.7 to 2.5, and having a content of Cu as an impurity of 0.05% or less, with the balance being Al and impurities, the aluminum alloy extruded product having an electric conductivity of 50% IACS or more and an average particle size of intermetallic compounds precipitating in a matrix of 1 ?m or less.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: August 3, 2010
    Assignees: Denso Corporation, Sumitomo Light Metal Industries, Ltd.
    Inventors: Yoshiharu Hasegawa, Tomohiko Nakamura, Masaaki Kawakubo, Naoki Yamashita, Tatsuya Hikida
  • Publication number: 20070017605
    Abstract: An aluminum alloy extruded product exhibiting excellent surface properties, comprising 0.8 to 1.6% of Mn and 0.4 to 0.8% of Si at a ratio of Mn content to Si content (Mn %/Si %) of 0.7 to 2.4, with the balance being Al and inevitable impurities, the number of intermetallic compounds with a diameter (circle equivalent diameter) of 0.1 to 0.9 ?m dispersed in a matrix being 2×105 or more per square millimeter. The aluminum alloy extruded product allows extrusion of a thin multi-port tube at a high limiting extrusion rate, prevents deposits from adhering to the surface of the extruded tube, and may be suitably used as a constituent member for an aluminum alloy automotive heat exchanger.
    Type: Application
    Filed: July 20, 2006
    Publication date: January 25, 2007
    Inventors: Tomohiko Nakamura, Masaaki Kawakubo, Yoshiharu Hasegawa, Naoki Yamashita, Tatsuya Hikida
  • Publication number: 20050189047
    Abstract: A high-strength aluminum alloy extruded product for heat exchangers which excels in extrudability, allows a thin flat multi-cavity tube to be extruded at a high critical extrusion rate, and excel in intergranular corrosion resistance at a high temperature, and a method of manufacturing the same. The aluminum alloy extruded product includes an aluminum alloy including 0.2 to 1.8% of Mn and 0.1 to 1.2% of Si, having a ratio of Mn content to Si content (Mn %/Si %) of 0.7 to 2.5, and having a content of Cu as an impurity of 0.05% or less, with the balance being Al and impurities, the aluminum alloy extruded product having an electric conductivity of 50% IACS or more and an average particle size of intermetallic compounds precipitating in a matrix of 1 ?m or less.
    Type: Application
    Filed: February 9, 2005
    Publication date: September 1, 2005
    Inventors: Yoshiharu Hasegawa, Tomohiko Nakamura, Masaaki Kawakubo, Naoki Yamashita, Yasunaga Itoh, Tatsuya Hikida