Patents by Inventor Tatsuya Hosotani

Tatsuya Hosotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210152021
    Abstract: An in-vivo implantable medical device includes a housing, an electronic circuit component, a power reception coil, and a magnetic material. The housing is formed of a biocompatible material and forms an internal space. The electronic circuit component is disposed in the internal space. The power reception coil is disposed in the internal space, interacts with an external electromagnetic field to form an electromagnetic resonance field to receive power. At least part of a region of the housing in which the electromagnetic resonance field is formed is formed of a biocompatible nonmetal material.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Norikazu SAKAMOTO, Tatsuya HOSOTANI, Kiyokazu YAMADA
  • Publication number: 20210152033
    Abstract: A wireless power transfer system includes a power transmitter including a high frequency power converter circuit that converts a direct current power into a high frequency power using a switching circuit, a power transmitter coil, and an electric field shield member close to the power transmitter coil and having a structure that uses a conductive member to form an equivalent capacitance between the electric field shield member and the power transmitter coil by electric coupling therebetween during a power transmitting operation such that the value of the equivalent capacitance becomes greater than the value of an equivalent capacitance formed between the power transmitter coil and ground. The power transmitter causes electric potentials in the electric field shield member to be identical using the conductive member, suppresses changes in an electric field in a vicinity of the power transmitter coil, and suppresses radiation of the electric field noise.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro NAGAI, Tatsuya HOSOTANI
  • Publication number: 20210145362
    Abstract: An in-vivo implantable electronic device includes a housing, a power reception coil, and an electronic circuit. The housing is formed of a biocompatible material and forms an internal space sealed. The power reception coil is disposed in the internal space of the housing and receives power by interacting with an electromagnetic field formed by an external electric field or magnetic field, or transmits an electromagnetic wave to the outside. The electronic circuit is disposed in the internal space, is connected to the power reception coil, and performs at least processing of an electric signal. The housing includes a first member in a box shape formed of a biocompatible metal material and having an opening, a second member formed of a biocompatible nonmetal material and having a shape that closes the opening, a packing in an annular shape disposed between the first member and the second member.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tatsuya HOSOTANI, Kiyokazu YAMADA
  • Patent number: 11011937
    Abstract: A switching circuit is connected to an output side of a DC power supply, includes a low-side switch circuit and a high-side switch circuit, and generates high frequency power by switching of the low-side switch circuit and the high-side switch circuit. Snubber circuits are connected between both ends of the low-side switch circuit and both ends of the high-side switch circuit. The snubber circuits include series circuits including inductors and capacitors, and include diodes that are connected in parallel with the inductors.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: May 18, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Publication number: 20210143686
    Abstract: A wireless power receiving circuit module includes a first base, a second base, electronic components, a power receiving coil, and a ground conductor pattern. The number of layers of the second base is different from that of the first base, and the second base does not overlap with the first base in a plan view and shares a predetermined dielectric layer with the first base. The electronic components are mounted on a first main surface of the first base. The power receiving coil is formed in the second base. The ground conductor pattern is disposed on a second main surface side in the first base and overlaps with the electronic components.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 13, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tatsuya HOSOTANI, Koyo KAIWA
  • Publication number: 20210143685
    Abstract: A planar-type wireless power-receiving circuit module includes a planar ground conductor, a substrate, a power-receiving coil, and a magnetic sheet. The planar ground conductor has a cavity in the middle section thereof. The substrate is disposed on a first main surface of the planar ground conductor. The substrate includes dielectric layers stacked on top of each other in a manner so as to form electronic circuitry. The power-receiving coil is electrically connected to the electronic circuitry and is disposed in the cavity. The magnetic sheet overlaps the power-receiving coil when the planar ground conductor is viewed in plan. The magnetic sheet is part of a path of magnetic flux passing through the power-receiving coil and is disposed on a first main surface of the power-receiving coil.
    Type: Application
    Filed: January 16, 2021
    Publication date: May 13, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Koyo KAIWA, Tatsuya HOSOTANI
  • Patent number: 10998772
    Abstract: An electric power transmitting device includes a radio frequency power circuit that converts a direct current power supply to radio frequency electric power having a switching frequency, a transmitting coil connected to the radio frequency power circuit and magnetically coupled to a receiving coil in an electric power receiving device, and a transmitting resonance capacitor that is connected to the transmitting coil and that forms a resonant circuit together with the transmitting coil. The transmitting coil has flexibility to allow a coil opening to be closed, and capacitance of the transmitting resonance capacitor is determined so that while the transmitting coil is opened, resonance of the resonant circuit occurs at a resonant frequency, which matches the switching frequency, and while the transmitting coil is substantially closed, the resonance of the resonant circuit does not occur at the switching frequency, which deviates from a resonant frequency of the resonant circuit.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: May 4, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Patent number: 10992183
    Abstract: A high-frequency power supply device includes a power transmission coil, a high-frequency power circuit which converts direct-current power input from a direct-current power supply into high-frequency power and supply the high-frequency power to the power transmission coil, a detection circuit which detects a voltage based on a circuit operation of the high-frequency power circuit and output a detected voltage, a control circuit configured to control a circuit operation of the high-frequency power circuit and to determine a command value used to protect the high-frequency power supply device based on information externally input into a processor, a D/A converter which performs D/A conversion upon receiving the command value output from the control circuit and output a command voltage, and a comparator which compares the command voltage and the detected voltage with each other and output a stop signal used to stop a circuit operation of the high-frequency power supply device.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: April 27, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Publication number: 20210111626
    Abstract: Power line patterns are, together with a ground pattern, provided separately from control line patterns. The power line pattern is formed at first and second major surfaces of a circuit board. When the circuit board is viewed in plan view, the power line pattern and the power line pattern form a line structure in which the power line pattern and the power line pattern are in parallel with and opposite to each other and the power line pattern is positioned under the power line pattern. The circuit board includes a dielectric between the power line pattern and the power line pattern. These together form an equivalent capacitor and the magnetic flux induced by the current flowing through the power line pattern and the magnetic flux induced by the current flowing through the power line pattern cancel each other out.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Osamu MIKI, Tatsuya HOSOTANI
  • Publication number: 20210104350
    Abstract: A planar array coil includes a multilayer substrate at which a plurality of coils are formed and arranged on a plane of the multilayer substrate. First ends of the plurality of coils are connected to switching circuit units of a power conversion circuit, and second ends of the plurality of coils are connected to a common output part. The coils include two coil parts in which currents flow in opposite rotation directions, and one coil part of one coil is adjacent to one coil part of another coil. The plurality of coils are connected such that operation of switching circuits causes currents in regions of adjacent coil parts that extend in parallel to each other to flow in the same direction. Accordingly, adverse effects by unwanted coupling between adjacent coils are reduced and a switching power supply device that includes the planar array coil performs stable power conversion operations.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tatsuya HOSOTANI, Osamu MIKI
  • Publication number: 20210104351
    Abstract: A switching power supply device includes a power conversion circuit that is provided at a multilayer printed board and includes a plurality of switching circuits and a controller controlling the switching circuits, windings configuring an inductor at the multilayer printed board, and a magnetic sheet on one or both of upper and lower faces of the multilayer printed board. First ends of the windings are connected to the switching circuits, and second ends of the windings are connected to a common output. The controller controls the plurality of switching circuits to periodically vary a position and a time at which magnetic flux generated by current flowing to the windings reaches the maximum magnetic flux density. Thus, the switching power supply device is thin, achieves dispersion of heat generation, handles variations in the magnitude of electric power by varying the area of the board, and effectively reduces unwanted radiation.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya HOSOTANI
  • Patent number: 10910880
    Abstract: A power transmission circuit is connected to a power transmission coil having a coil aperture. The power transmission circuit includes a conductive or magnetic power-transmission-coil near member opposed to the coil aperture of the power transmission coil, and a repeating coil arranged on a side opposite to a side on which the power-transmission-coil near member is arranged with respect to the power transmission coil and coupled to the power transmission coil at least via a magnetic field. When a shortest distance between the power transmission coil and the power-transmission-coil near member is expressed as (dt1) and a shortest distance between the power transmission coil and the repeating coil is expressed as (dt2), dt2?dt1.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: February 2, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Patent number: 10897155
    Abstract: A power transmission device includes a power transmission coil, a power-transmission resonance capacitor that forms, together with the power transmission coil, a power-transmission resonance mechanism, and a power transmission circuit electrically connected to the power-transmission resonance mechanism that intermittently applies a direct-current input voltage to the power-transmission resonance mechanism and causes the power transmission coil to generate an alternating-current voltage. The power transmission circuit includes a control circuit section including an oscillator, and a power circuit section formed of an integrated circuit sealed in a small-sized package with a plurality of terminals. The integrated circuit is electrically and directly connected to the power-transmission resonance mechanism. The control circuit section oscillates at a predetermined frequency and outputs a driving signal which is input to the power circuit section.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: January 19, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Patent number: 10893635
    Abstract: A high frequency power circuit module includes an electronic circuit substrate having a bending section, a high frequency power circuit formed on the electronic circuit substrate, a battery connected to the high frequency power circuit, and a magnetic material sheet having an area larger than that of the battery. The battery is covered with the magnetic material sheet in a state in which the electronic circuit substrate is bent at a bending section. The high frequency power circuit, the battery, and the magnetic material sheet are thermally coupled to each other by a resin sealing member, which is a material having a smaller thermal resistance than that of air.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 12, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Patent number: 10862339
    Abstract: A power reception device includes a power reception coil configured to couple with a power transmission coil included in a power transmission device; a rectifier circuit including a diode and a transistor electrically connected to the power reception coil and configured to rectify a high frequency AC current flowing in the power reception coil; outputs configured to output the current rectified by the rectifier circuit to a load; a voltage detection circuit configured to detect an output voltage Va; and a controller configured to control an operation of the transistor based on the output voltage Va. The controller turns off the transistor when the output voltage Va?the threshold value Va1 is satisfied and causes the rectifier circuit to execute a rated rectification operation, and turns on the transistor when the voltage Va?the threshold value Va2 is satisfied and stops the rated rectification operation.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: December 8, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Patent number: 10756577
    Abstract: A wireless power supply system includes a power transmission device and a power reception device. A control circuit in the power transmission device causes a power transmission circuit to operate, by a pulse-density modulation control method of controlling density of oscillation pulses for a predetermined period of time, in relationship De1>De2>De3, where De1 indicates the pulse density determined on the basis of a result of demodulation of a transmission signal from the power reception device, De2 indicates the pulse density in a state where a detected output value from the power transmission circuit reaches a predetermined value, and De3 indicates the pulse density in a state where a detected temperature values of a switch element reaches a predetermined value.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 25, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Hosotani
  • Publication number: 20200169120
    Abstract: A high-frequency power supply device includes a power transmission coil, a high-frequency power circuit which converts direct-current power input from a direct-current power supply into high-frequency power and supply the high-frequency power to the power transmission coil, a detection circuit which detects a voltage based on a circuit operation of the high-frequency power circuit and output a detected voltage, a control circuit configured to control a circuit operation of the high-frequency power circuit and to determine a command value used to protect the high-frequency power supply device based on information externally input into a processor, a D/A converter which performs D/A conversion upon receiving the command value output from the control circuit and output a command voltage, and a comparator which compares the command voltage and the detected voltage with each other and output a stop signal used to stop a circuit operation of the high-frequency power supply device.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya HOSOTANI
  • Publication number: 20200127497
    Abstract: A switching circuit is connected to an output side of a DC power supply, includes a low-side switch circuit and a high-side switch circuit, and generates high frequency power by switching of the low-side switch circuit and the high-side switch circuit. Snubber circuits are connected between both ends of the low-side switch circuit and both ends of the high-side switch circuit. The snubber circuits include series circuits including inductors and capacitors, and include diodes that are connected in parallel with the inductors.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya HOSOTANI
  • Publication number: 20200124483
    Abstract: A power circuit module includes an electronic circuit board, a heat generating element mounted on a first surface of the electronic circuit board and being a semiconductor electronic component that constitutes a part of a power circuit, a temperature detecting element that detects the temperature of the heat generating element, an electric circuit wiring, a heat dissipating body that dissipates heat of the heat generating element, and a heat conduction sheet having elasticity and flexibility, and a thickness. The heat conduction sheet is between the heat generating element and the heat dissipating body, the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and with regard to the sizes of the components, the following relationship holds: temperature detecting element<heat generating element<heat dissipating body.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya HOSOTANI
  • Publication number: 20200128689
    Abstract: A high frequency power circuit module includes an electronic circuit substrate having a bending section, a high frequency power circuit formed on the electronic circuit substrate, a battery connected to the high frequency power circuit, and a magnetic material sheet having an area larger than that of the battery. The battery is covered with the magnetic material sheet in a state in which the electronic circuit substrate is bent at a bending section. The high frequency power circuit, the battery, and the magnetic material sheet are thermally coupled to each other by a resin sealing member, which is a material having a smaller thermal resistance than that of air.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya HOSOTANI