Abstract: A wafer placement includes an alumina substrate having a wafer placement surface at an upper surface, and incorporating an electrode; a brittle cooling substrate which is bonded to a lower surface of the alumina substrate, and in which a refrigerant flow path is formed; and a ductile connection member stored in a storage hole opened in a lower surface of the cooling substrate in a state of restricted axial rotation and in a state of being engaged with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section, wherein the storage hole is provided in the refrigerant flow path.

Abstract: A wafer placement table includes an alumina base that has a wafer placement surface on its upper surface, and incorporates an electrode; a brittle cooling base bonded to a lower surface of the alumina base; and a ductile connection member stored in a storage hole, opened in a lower surface of the cooling base, in a state of restricted axial rotation and in a state of engaging with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section.

Abstract: A moisture control material including a salt composed of a pyrazolium cation represented by the formula (N1) and a phosphate ester anion. In formula (N1), RN1, RN2, RN3, RN4 and RN5 are each independently a hydrogen atom, or an alkyl group having 1 to 12 carbon atoms which optionally has a hydroxy group and optionally includes one or more oxygen atoms in the chain. One or more of RN1 and RN2 which are substituents on a nitrogen atom that constitutes a 5-membered ring are alkyl groups having 1 to 12 carbon atoms, which optionally have a hydroxy group and optionally include one or more oxygen atoms in the chain.

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface including a reference surface on which multiple small projections for supporting a wafer are provided and that contains an electrostatic electrode; a plug arrangement hole that is provided in the ceramic plate; an electrostatic electrode opening portion that is provided at a position in the electrostatic electrode through which the plug arrangement hole extends; a cooling plate that is provided on a lower surface of the ceramic plate; a gas hole that extends through the cooling plate and that is in communication with the plug arrangement hole; a plug that is arranged in the plug arrangement hole and that includes a gas flow path; and a raised portion that surrounds the gas flow path and that has a top surface higher than the reference surface and lower than top surfaces of the small projections.

Abstract: A wafer placement table includes: a ceramic substrate that has a wafer placement surface at an upper surface of the ceramic substrate; an electrode that is incorporated in the ceramic substrate; and an electrically conductive electrode extraction portion that is incorporated in the ceramic substrate and is electrically connected to the electrode. A volume content percentage of a ceramic material that is identical to a main component of the ceramic substrate is high in the electrode extraction portion compared with the electrode.

Abstract: A self-propelled robot transfer system and a transfer robot used in the system is provided with which, when a reinforcing bar binding self-propelled robot reaches near the end of a reinforcing bar while moving on the reinforcing bar as a track, an operator can move the self-propelled robot in the opposite direction using another reinforcing bar as a new track without having to lift the self-propelled robot by himself, as a result of which, turnaround working of the self-propelled robot can be easily achieved.

Abstract: A member for semiconductor manufacturing apparatus includes a central ceramic member having a wafer placement surface on an upper surface; an annular outer circumferential ceramic member having a focus ring placement surface on an upper surface; and a conductive base member having a central support joined to the central ceramic member, and an outer circumferential support joined to the outer circumferential ceramic member, wherein an outer circumferential surface of the central ceramic member and an inner circumferential surface of the outer circumferential ceramic member each change in diameter in an up-down direction, and a maximum diameter of the outer circumferential surface of the central ceramic member is smaller than a maximum diameter of the inner circumferential surface of the outer circumferential ceramic member, and larger than a minimum diameter of the inner circumferential surface of the outer circumferential ceramic member, and the central ceramic member is insulating ceramics.

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate including a horizontal and circular wafer placement surface, and a horizontal and annular focus ring placement surface provided on an outer circumference of the wafer placement surface at a position lower than the wafer placement surface by one step, and a connection part that connects the wafer placement surface and the focus ring placement surface; and a cooling plate provided on a lower surface of the ceramic plate, wherein the connection part has a lateral surface of a circular truncated cone with a diameter that increases from the wafer placement surface to the focus ring placement surface, and the diameter of the upper surface of the circular truncated cone matches the outer diameter of the wafer placement surface, and the diameter of the lower surface of the circular truncated cone matches the inner diameter of the focus ring placement surface.

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate having a wafer placement surface on an upper surface, an electrostatic electrode embedded in the ceramic plate, an electrode lead-out portion embedded in the ceramic plate and extending downward from the electrostatic electrode, a terminal hole extending from a lower surface of the ceramic plate to the electrode lead-out portion, a terminal in the terminal hole, a conductive bonding portion located between the terminal and the electrode lead-out portion and bonding the terminal and the electrode lead-out portion together. The terminal hole has a terminal hole tapering surface that tapers toward a bottom of the hole, and the terminal hole tapering surface intersects a lateral surface of the electrode lead-out portion.

Abstract: A wafer placement table includes an upper substrate including a ceramic substrate and having a wafer placement surface, a lower substrate disposed on a lower surface of the upper substrate including a refrigerant flow path or a refrigerant flow-path groove, a through hole extending through the lower substrate in an up-down direction to intersect with the refrigerant flow path or the refrigerant flow-path groove, a screw hole provided in the lower surface of the upper substrate, at a position facing the through hole, a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole, and a refrigerant-leakage prevention member that prevents the refrigerant from leaking out to the lower surface of the lower substrate through the through hole into which the screw member is inserted.

Abstract: There is provided a method for producing a fluoropolymer, the method including polymerizing a fluoromonomer in an aqueous medium to obtain a polymerization dispersion containing the fluoropolymer, and bringing the fluoropolymer in the polymerization dispersion into contact with an alcohol having 3 to 5 carbon atoms to coagulate the fluoropolymer to thereby obtain the fluoropolymer.

Abstract: Provided is a composition containing: a polymer (I) having a polymerization unit (I) based on a monomer (I) represented by general formula (I); and a fluoroelastomer, wherein a content of the polymer (I) is 0.0001 to 1.0% by mass based on the fluoroelastomer: CX1X3?CX2R(—CZ1Z2-A0)m??(I) wherein X1 and X3 are each independently F, Cl, H, or CF3; X2 is H, F, an alkyl group, or a fluorine-containing alkyl group; A0 is an anionic group; R is a linking group; Z1 and Z2 are each independently H, F, an alkyl group, or a fluorine-containing alkyl group; and m is an integer of 1 or more.

Abstract: A temperature control method includes providing a substrate processing apparatus including a processing container, and a heater that heats the processing container; setting an amount of temperature change with respect to a target temperature having a value up to a second digit smaller than a first digit indicating a control limit value of the heater; dividing the amount of temperature change into a first temperature equal to or greater than the first digit and a second temperature less than the first digit, and calculating a ratio of dividing a time segmented by a digit difference between the first digit and the second digit, into a first time corresponding to the second temperature and a second time other than the first time; and controlling the heater to raise or lower a temperature in times before and after dividing a processing time in a processing step at the ratio.

Abstract: A relay device relays communication. The relay device includes: a receiving unit that receives communication data from a communication device; a storage unit that stores the communication data received by the receiving unit; and a processing unit that performs processing. A first period and a second period are alternately set. The processing unit changes the total number of the first periods and the second periods included in a next predetermined period each time a predetermined period including the first periods and the second periods passes. The processing unit determines whether or not the communication data is stored in the storage unit. When it is determined that the communication data is stored in the storage unit, the processing unit specifies a period to which a communication determination time at which the determination has been performed belongs, from the first period and the second period.

Abstract: An audio device capable of inhibiting malfunction of an information terminal is provided. The audio device includes a sound sensor portion, a sound separation portion, a sound determination portion, and a processing portion. The sound sensor portion has a function of sensing sound. The sound separation portion has a function of separating the sound sensed by the sound sensor portion into a voice and sound other than a voice. The sound determination portion has a function of storing the feature quantity of the sound. The sound determination portion has a function of determining, with a machine learning model such as a neural network model, whether the feature quantity of the voice separated by the sound separation portion is the stored feature quantity. The processing portion has a function of analyzing an instruction contained in the voice and generating an instruction signal representing the content of the instruction in the case where the feature quantity of the voice is the stored feature quantity.

Abstract: A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

Abstract: A member for a semiconductor manufacturing apparatus, includes: a ceramic plate that has a ceramic plate through hole; an electroconductive base plate that has a base plate through hole and that is disposed on a lower surface side of the ceramic plate; an insulating sleeve which is inserted into the base plate through hole and of which an outer peripheral surface is adhered to an inner peripheral surface of the base plate through hole via an adhesion layer; and a sleeve through hole that passes through the insulating sleeve in the up-down direction and that communicates with the ceramic plate through hole. The insulating sleeve has a tool engaging portion that is engageable with an external tool, and upon being engaged with the external tool, the tool engaging portion transmits rotation torque of the external tool to the insulating sleeve.

Abstract: A dental restorative curable compositions may have a high mechanical strength and excellent water resistance and polishability in the form of a cured product. A dental composite resin may include such compositions. A dental mill blank may include the cured product of such compositions. A dental restorative curable composition may include: a (meth)acrylic acid ester compound (A) having two or more (meth)acryloyloxy groups per molecule; a mono(meth)acrylic acid ester compound (B); an inorganic filler (C) having an average primary particle diameter of 0.01 to 5 ?m; and a polymerization initiator (D).

Abstract: A wafer placement table includes: a ceramic substrate having a wafer placement surface at an upper surface, and incorporating an electrode; a cooling substrate which is bonded to a lower surface of the ceramic substrate, and in which a refrigerant flow path is formed; a power supply terminal connected to the electrode; and a power supply terminal hole vertically penetrating the cooling substrate and storing the power supply terminal. The power supply terminal hole intersects with the refrigerant flow path.

Abstract: A management device includes: a first communication unit that receives state data of an energy storage device; a second communication unit that receives identification data transmitted from a host device; an external terminal to which a switch is connected and which receives an input from the switch; a state detection unit that detects a state of the switch via the external terminal; and a processing unit that stores the identification data in a storage unit when the second communication unit receives the identification data and the state detection unit detects that the switch is in a specific state, in which the state data received by the first communication unit is transmitted to the host device or another device in association with the identification data stored in the storage unit.