Abstract: The purposes of the present invention are: to provide an epoxy resin composition having excellent impregnation into reinforcing fibers, excellent shapability under low-temperature conditions after thickening, and excellent heat resistance after curing; to provide a molding material for a fiber-reinforced composite material, said molding material having excellent shapability during handling and excellent fluidity during press molding; and to provide a fiber-reinforced composite material having excellent heat resistance and bending strength. To achieve the abovementioned purposes, the present invention provides an epoxy resin composition containing all of the following components (A)-(D), wherein: the content of the component (A), in terms of 100 mass % of the total mass of the epoxy resin composition, is 30-95 mass %; and the ratio Wc/Wd of the content We of the component (C) to the content Wd of the component (D) is 0.01-10.

Abstract: A member for a semiconductor manufacturing apparatus includes a ceramic plate; a composite plate joined to a lower surface of the ceramic plate; a cooling plate formed of a metal material, disposed on a lower surface of the composite plate; a first fastener that fastens the composite plate and the cooling plate; a support plate that is formed of an insulating material and supports a lower surface of the cooling plate; and a second fastener that fastens the cooling plate and the support plate, wherein, when the ceramic plate is heated from room temperature to high temperature, a first layered body including the ceramic plate and the composite plate deforms such that a central portion of the first layered body is convex, and a second layered body including the cooling plate and the support plate deforms such that a central portion of the second layered body is convex.

Abstract: A wafer placement table includes a ceramic plate that has at least a wafer placement part at an upper surface thereof, a cooling plate that is joined to a lower surface of the ceramic plate and that has a refrigerant flow path, gas common paths that are provided above the refrigerant flow path, gas introduction paths that extend from a lower surface of the cooling plate to a corresponding one of the gas common paths, and a plurality of gas distribution paths, that are provided for the gas common paths. The gas distribution path that is disposed at an outermost periphery of the ceramic plate is provided at a position that does not overlap the refrigerant flow path in plan view.

Abstract: An attachment structure of a flat wire harness includes: an attachment target member; a flat wire harness; and an attachment part. In the flat wire harness, a through hole is formed in a part of a base material where a plurality of electrical wires are not disposed. The attachment part includes a rod-like part passing through the through hole, a fixing part provided to a first end portion of the rod-like part to fix the rod-like part to the attachment target member, and a retaining part provided to a second end portion of the rod-like part to prevent the rod-like part from coming out of the through hole. An outer size of the retaining part is larger than a dimension of the through hole, and the dimension of the through hole is equal to or larger than a thickness of the rod-like part.

Abstract: A conjugate fiber includes two or more types of polymers, and having a fiber cross section in which a plurality of interfaces is formed, in which the conjugate fiber has a value, which is obtained by dividing a sum of lengths of interfaces between two types of the polymers by an area of the fiber cross section, of 0.0010 nm?1 or more, and each of the interfaces is continuous in a fiber axis direction.

Abstract: A cooling structure includes battery modules including battery cells, an intake duct allowing cooling air to flow to the battery modules, and a chamber communicating with the intake duct. The chamber is interposed between the adjacent battery modules. The chamber includes a body, sealing members, and a reinforcing rib. The body has a box shape and includes openings at both ends in an arrangement direction of the battery modules, and communicates with each battery module. Each sealing member is disposed at a coupling area. The reinforcing rib is provided in an internal space of the body and coupled to first and second parts of the body apart from each other in a height direction of the body. The reinforcing rib extends between the first and second parts. The body is supported with being held between the battery modules. The cooling air is sent to the battery modules via the chamber.

Abstract: A cooling structure of a battery pack includes a battery case, an intake duct, and an intake port. The battery case houses a battery module and electronic equipment coupled to the battery module. The intake duct communicates with the battery case and is configured to send cooling air for cooling the battery module. The intake port is disposed in a top plate of the battery case and is configured to send the cooling air into the battery case. The intake duct is coupled to the top plate so as to communicate with the battery case via the intake port and extends from the intake port to an end of the top plate. The intake duct is provided with a bent part that is downwardly bent in a vicinity of the end of the top plate.

Abstract: A wire harness includes: an electric wire; a first tape wrapping body in which a first adhesive tape is wrapped around a first electric wire portion of a first wrapping section directed to one side from a base point in an axial direction of the electric wire; and a second tape wrapping body in which a second adhesive tape is wrapped around a second electric wire portion of a second wrapping section directed to another side from the base point in the axial direction of the electric wire.

Abstract: A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole; and a thermally conductive paste interposed, for example, between side surfaces of the projections and an inner peripheral surface of the projection insertion hole of the heat dissipation sheet.

Abstract: A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole.

Abstract: A cooling structure of a battery pack includes a battery case, an intake duct, and a blower. The battery case contains a battery module. The intake duct communicates with the battery case and is configured to send cooling air for cooling the battery module. The blower is configured to supply the cooling air to the intake duct. The intake duct has a bent section in which the cooling air that is sent from an upper side to a lower side is sent again from the lower side to the upper side. In the bent section of the intake duct, a vibration absorber is provided at least at a collision area to be collided with the cooling air.

Abstract: Provided is a compound represented by formula (1): In the formula, A represents a polymerizable group; L represents an optionally branched (n+1)-valent linking group; R1 represents an aromatic ring group optionally having a substituent; R2 represents a monovalent organic group optionally having a substituent; X1 and X2 each independently represent an oxygen atom, a sulfur atom, or a nitrogen atom optionally having a substituent; m represents an integer of 0 or 1; n represents an integer of 1 to 3; and p represents an integer of 0 or 1. The two R1s may be bonded together at any position to form a ring structure and R1=R2, X1=X2, and p=1 do not hold simultaneously. The compound simultaneously has a high refractive index and high transparency.

Abstract: An antenna cable noise suppression structure includes a plurality of antenna cables and a noise suppression member that has electrical conductivity and is electrically connected to each of outer conductors of two or more antenna cables. Further, the noise suppression member is electrically connected to an outer conductor of each antenna cable at a position at which a distance from an end of each antenna cable is equal to or less than one quarter of a wavelength calculated based on a frequency of a signal transmitted by each antenna cable. Further, the noise suppression member and the outer conductor that is electrically connected to the noise suppression member are grounded to a grounded portion.

Abstract: An information processing apparatus includes an acquisition unit configured to acquire a video of a swing of a golfer who strikes a golf ball with a golf club, a calculation unit configured to calculates a feature amount of the swing from the video, and a conversion unit configured to convert the feature amount into an estimated value of a behavior of a golf club head by substituting the feature amount into a conversion formula.

Abstract: The present disclosure relates to an autonomous mobile device, a control method, and a program which enable higher-speed self-position estimation with higher accuracy and with a smaller calculation load. Provided is an autonomous mobile device including: a sensor unit including at least a first sensor that detects an angular velocity, a second sensor that is installed in a housing and detects a speed of a wheel, and a third sensor that detects a displacement amount on a two-dimensional plane; and a self-position estimation unit that estimates a self-position on the basis of parameters calculated by the sensor unit, the self-position estimation unit using a predetermined parameter suitable for a predetermined condition among the parameters of the respective sensors calculated by the sensor unit when estimating the self-position. The present disclosure can be applied to, for example, an autonomous mobile robot device.

Abstract: A shoe is provided with a first forming portion provided on a medial side and a second forming portion provided on a lateral side across a central opening formed forward from a foot insertion portion of an upper on each of which a string passing portion is formed; a first support member a tip end of which is fixed to the second forming portion, including a first string passing structure provided at the tip end, and extending downward so as to abut a medial side of a foot; a second support member a tip end of which is fixed to the first forming portion, including a second string passing structure provided at the tip end, and extending downward so as to abut a lateral side of the foot; and a shoelace which passes through the string passing portion and continuously passes through the first and second string passing structures.

Abstract: Diagonal beam joining hardware according to one or more embodiments includes: a beam splicing part; an extending part protruding from an appropriate intermediate part of the beam splicing part; and a beam receiving hardware mounting part bending and extending from an end edge of the extending part to form a predetermined plane angle with respect to the beam splicing part. The beam splicing part is attached and fastened to a side face of a continued beam by through bolts and penetrating the beam in the beam width direction. Beam receiving hardware is fitted in a slit formed in an end part of the diagonal beam. A contacting part of the beam receiving hardware is superimposed on the beam receiving hardware mounting part of the diagonal beam joining hardware and fastened by bolt/nut fastening.

Abstract: A building structure 1a, 1b, and 1c incorporates an outer wall 6 provided on a lower side of a sloped ceiling 2 in a slope direction, an opening part 5 formed in the outer wall 6, a box-shaped groove part 15 formed at a lower end of the sloped ceiling 2 along the outer wall 6 and having a lower opening 14 opened downward, and an attachment part 17 provided inside the groove part 15 and to which an upper end part of a light shielding material 16 that shields light incident on the opening part 5 is attached, wherein the groove part 15 is a ceiling-embedded type embedded in the sloped ceiling 2, and a lower end of a side plate of the groove part 15 on a side opposite to the opening part 5 is lower than a height of a lower surface of a frame 23 on an upper side of the opening part 5.