Patents by Inventor Tatsuya Ito
Tatsuya Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170080940Abstract: A control device detects a first vehicle traveling in front of an own vehicle using a front looking radar device, and detects a second vehicle which is predicted to cut in between the own vehicle and the first vehicle using the front looking radar device and/or front-side looking radar devices. The control device calculates a first target acceleration required for the own vehicle to maintain an inter-vehicle distance between the own vehicle and the first vehicle at a first set inter-vehicle distance; and calculates a second target acceleration required for the own vehicle to maintain an inter-vehicle distance between the own vehicle and the second vehicle at a second set inter-vehicle distance. The control device selects either the first target acceleration or the second target acceleration and controls the own vehicle in such a manner that an actual acceleration of the own vehicle becomes closer to the mediated target acceleration.Type: ApplicationFiled: September 23, 2016Publication date: March 23, 2017Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Tatsuya ITO
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Patent number: 9578743Abstract: A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.Type: GrantFiled: September 18, 2015Date of Patent: February 21, 2017Assignee: NGK SPARK PLUG CO., LTD.Inventors: Makoto Nagai, Seiji Mori, Tatsuya Ito
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Patent number: 9518590Abstract: It is an object of the invention to provide a motor-driven compressor being fixable reliably to a vehicle or the like and being capable of reliably protecting elements accommodated in a housing even upon reception of an external force due to a collision by any possibility. A motor-driven compressor of the invention comprises a compression mechanism for compressing fluid, an electric motor for driving the compression mechanism, a motor drive circuit for driving the electric motor, and a housing. The housing accommodates the compression mechanism, the electric motor, and the motor drive circuit. A cover for protecting the housing from an external force caused by a collision is fixed to the outside of the housing. The cover is arranged via a clearance with respect to the housing, and absorbs the external force applied to the cover by the clearance.Type: GrantFiled: June 28, 2013Date of Patent: December 13, 2016Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Tomoharu Arai, Tatsuya Ito, Ken Suitou
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Patent number: 9516751Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction.Type: GrantFiled: May 17, 2013Date of Patent: December 6, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takahiro Hayashi, Makoto Nagai, Seiji Mori, Tomohiro Nishida, Makoto Wakazono, Tatsuya Ito
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Publication number: 20160351039Abstract: A technique capable of immediately reporting to an operator an occurrence of abnormality in an electric tool is provided. A communication terminal 100 includes a communication-terminal-side control unit that determines whether abnormality has occurred in any of electric tools 10, 200, 300, and 400 based on information acquired from the electric tools 10, 200, 300, and 400 via wireless communication. When the communication-terminal-side control unit determines the occurrence of abnormality in any one of the electric tools 10, 200, 300, and 400, the occurrence of abnormality in the electric tool 10, 200, 300, or 400 is reported by at least one of a report unit included in the electric tools 10, 200, 300, and 400 other than the electric tool 10, 200, 300, or 400 in which the occurrence of abnormality is determined and a report unit included in the communication terminal 100.Type: ApplicationFiled: January 9, 2015Publication date: December 1, 2016Inventors: Tomomasa NISHIKAWA, Takuya KONNAI, Tatsuya ITO
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Patent number: 9485853Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.Type: GrantFiled: May 16, 2012Date of Patent: November 1, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventors: Tatsuya Ito, Seiji Mori, Takahiro Hayashi, Makoto Wakazono, Tomohiro Nishida
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Patent number: 9473055Abstract: An electric working machine including: an input part; a control unit configured to control a motor in accordance with an operation amount of the input part; and a switching part; wherein, when a predetermined operation is performed to the switching part, the control unit shifts to a fixed control mode in which the motor is controlled in accordance with an operation amount of the input part at the time when the predetermined operation is performed to the switching part, irrespective of an operation amount of the input part after the predetermined operation is performed to the switching part.Type: GrantFiled: August 15, 2013Date of Patent: October 18, 2016Assignee: HITACHI KOKI CO., LTD.Inventors: Tatsuya Ito, Mizuho Nakamura, Yoshio Iimura, Tomomasa Nishikawa
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Patent number: 9420703Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.Type: GrantFiled: May 27, 2013Date of Patent: August 16, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takahiro Hayashi, Makoto Nagai, Tatsuya Ito, Seiji Mori, Makoto Wakazono, Tomohiro Nishida
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Patent number: 9346299Abstract: Provided is a recording apparatus including a controller which controls a recording operation relating to a recording medium, a carriage which can move in a predetermined movement direction, a cable which is connected to both the controller and the carriage and passes across the upper side of at least a part of a carriage movement area in the predetermined movement direction, and a metallic member which partially shields at least a part of the cable, which is a portion extending in a direction intersecting the predetermined movement direction, a guiding member which is formed of metal and guides the cable and a substrate which constitutes the controller. The metallic member is mounted on the guiding member, in a state where the cable is pinched between the metallic member and the guiding member. The metallic member is electrically connected to a ground in the substrate.Type: GrantFiled: December 3, 2014Date of Patent: May 24, 2016Assignee: Seiko Epson CorporationInventor: Tatsuya Ito
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Publication number: 20160090987Abstract: An electric compressor includes an inverter housing accommodating an inverter, a compressor housing accommodating a compression mechanism and an electric motor, and a seal member having an annular shape and interposed between an end surface of a peripheral wall of the compressor housing and an end surface of the inverter housing. The compressor housing has the peripheral wall in which the inverter is disposed. The seal member is retained to the inverter housing by a retaining structure which is disposed inside the peripheral wall of the compressor housing. The retaining structure includes a first projection and a second projection. The first projection is formed on the seal member and projects radially inward. The second projection is formed on the inverter housing. The first projection is located between the second projection and the end surface of the inverter housing so as to restrict movement of the seal member in a direction.Type: ApplicationFiled: September 28, 2015Publication date: March 31, 2016Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Takuro YAMASHITA, Tatsuya ITO, Tetsuya YAMADA
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Publication number: 20160095216Abstract: A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.Type: ApplicationFiled: September 18, 2015Publication date: March 31, 2016Inventors: Makoto NAGAI, Seiji MORI, Tatsuya ITO
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Publication number: 20160073071Abstract: An image projection apparatus includes laser light sources that each emit laser light; a beam combiner combining the laser lights; a beam deflector periodically changing a traveling direction of the combined laser lights and directing the laser lights to a screen; and a controller controlling a drive current supplied to the laser light sources based on a relationship between the drive current and a total light intensity outputted from the laser light sources, in which the total light intensity comprises three ranges, the controller supplies the drive current to the laser light sources when the laser lights are emitted in the total light intensity included in either the first or the third range, and the controller supplies the drive current to at least one or some of the laser light sources when the combined laser lights are emitted in the total light intensity included in the second range.Type: ApplicationFiled: September 4, 2015Publication date: March 10, 2016Applicant: FUNAI ELECTRIC CO., LTD.Inventors: Kenji Nagashima, Toyoshi Nogami, Tatsuya Ito
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Publication number: 20150357277Abstract: To provide a wiring substrate which can reliably prevent progress of cracking in a solder bump, and which exhibits improved reliability. The wiring substrate 10 of the present invention includes a substrate main body 11, pads 61, and a solder resist 81. The pads 61 are provided on the substrate back surface 13 of the substrate main body, and have surfaces 62 on which solder bumps 84 employed for connection of a motherboard 91 can be formed. The solder resist 81 covers the substrate back surface 13 of the substrate main body, and has openings 82 through which the pads 61 are exposed. A protrusion 71 is formed on a portion of the surface 62 of each pad 61. The height A4 of the end surface 72 of the protrusion 71, as measured from the surface 62 of the pad 61, is smaller than the depth of each opening 82.Type: ApplicationFiled: December 12, 2013Publication date: December 10, 2015Inventors: Makoto NAGAI, Seiji MORI, Tatsuya ITO, Takahiro HAYASHI
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Patent number: 9194394Abstract: A motor-driven compressor includes an electric motor having a stator core, a compression mechanism driven by the electric motor, a motor housing accommodating the electric motor, and a cluster block engaged with the stator core in the motor housing. The stator core of the electric motor and the motor housing are assembled by shrink fit. The cluster block accommodates a connecting terminal for electrical connection between a conductor connected to a motor drive circuit and a lead wire drawn from the electric motor. The cluster block has a terminal hole for receiving the connecting terminal and has an opening that is provided separately from the terminal hole.Type: GrantFiled: January 16, 2013Date of Patent: November 24, 2015Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Tetsuya Yamada, Tatsuya Ito, Ken Suitou
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Publication number: 20150313015Abstract: Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction.Type: ApplicationFiled: May 27, 2013Publication date: October 29, 2015Inventors: Hidetoshi WADA, Tatsuya ITO, Makoto NAGAI
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Patent number: 9121411Abstract: A motor-driven compressor includes a compression mechanism compressing and discharging fluid, an electric motor driving the compression mechanism, a drive circuit controlling the electric motor, a drive circuit chamber accommodating the drive circuit and a hermetic sealing inspection port that allows the drive circuit chamber to be in communication with the outside thereof. The hermetic sealing inspection port includes a valve opening and closing the hermetic sealing inspection port. The drive circuit chamber can be pressurized or depressurized through the hermetic sealing inspection port. The hermetic sealing inspection is conducted by connecting an outside fluid machine to the hermetic sealing inspection port through a detachable tube. The fluid machine is operated so as to depressurize or pressurize the drive circuit chamber through the hermetic sealing inspection port. The pressure in the drive circuit chamber is measured by a pressure meter provided in the tube.Type: GrantFiled: December 31, 2012Date of Patent: September 1, 2015Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventor: Tatsuya Ito
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Publication number: 20150216059Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.Type: ApplicationFiled: May 27, 2013Publication date: July 30, 2015Inventors: Takahiro Hayashi, Makoto Nagai, Tatsuya Ito, Seiji Mori, Makoto Wakazono, Tomohiro Nishida
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Publication number: 20150208501Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction.Type: ApplicationFiled: May 17, 2013Publication date: July 23, 2015Inventors: Takahiro Hayashi, Makoto Nagai, Seiji Mori, Tomohiro Nishida, Makoto Wakazono, Tatsuya Ito
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Publication number: 20150189752Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.Type: ApplicationFiled: July 29, 2013Publication date: July 2, 2015Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito
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Publication number: 20150183250Abstract: Provided is a recording apparatus including a controller which controls a recording operation relating to a recording medium, a carriage which can move in a predetermined movement direction, a cable which is connected to both the controller and the carriage and passes across the upper side of at least a part of a carriage movement area in the predetermined movement direction, and a metallic member which partially shields at least a part of the cable, which is a portion extending in a direction intersecting the predetermined movement direction. a guiding member which is formed of metal and guides the cable and a substrate which constitutes the controller. The metallic member is mounted on the guiding member, in a state where the cable is pinched between the metallic member and the guiding member. The metallic member is electrically connected to a ground in the substrate.Type: ApplicationFiled: December 3, 2014Publication date: July 2, 2015Inventor: Tatsuya ITO