Abstract: A push-in mechanism pushes articles into a box that is opened sideways. The push-in mechanism is provided with a box standby part, an article placement part, a push-in plate, a horizontal movement mechanism, and a lifting/lowering mechanism. The box standby part causes the boxes to wait. The article placement part has a placement surface on which the articles are temporarily placed. The push-in plate is installed in a standing state so as to have a pressing surface for pressing the articles toward the box. The horizontal movement mechanism causes the push-in plate to reciprocate horizontally above the placement surface so that the push-in plate moves toward the box or moves away from the box. The lifting/lowering mechanism moves the push-in plate so as to change a separation distance in the height direction between a lower edge of the pressing surface and the placement surface.

Abstract: Provided is a boxing apparatus that may repeatedly push products packaged in a soft packaging material into a box through a lateral opening and to pack the products in a plurality of rows, wherein product-filled rate may be easily enhanced without damaging the products. A boxing apparatus 10 may pack a plurality of rows of bagged products into a box. The boxing apparatus may be provided with a push-in mechanism 50, a shutter, a vertical movement mechanism, and a controller 41. The push-in mechanism may push the products into the box through a lateral opening in the box. The shutter may enter and exit the box through the opening. The vertical movement mechanism may move the box and the shutter up and down relative to each other.

Abstract: A semiconductor device includes a first ceramic substrate, a second ceramic substrate, an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a first surmounting portion formed on an upper surface of the second ceramic substrate, a second surmounting portion formed on the upper surface of the second ceramic substrate, a first connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the first surmounting portion, and a second connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the second surmounting portion, a circuit pattern formed on the second ceramic substrate, and a semiconductor element provided on the circuit pattern.

Abstract: A semiconductor device includes a first ceramic substrate, a second ceramic substrate, an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a first surmounting portion formed on an upper surface of the second ceramic substrate, a second surmounting portion formed on the upper surface of the second ceramic substrate, a first connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the first surmounting portion, and a second connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the second surmounting portion, a circuit pattern formed on the second ceramic substrate, and a semiconductor element provided on the circuit pattern.

Abstract: Disclosed is a device which is mounted on a vehicle, and captures a rear region of a vehicle and a blind spot region outside of a viewing range of a side mirror adjacent to the rear region of the vehicle. A captured image is subjected to image processing so that the blind spot region on the captured image is compressed. The image after subjected to the image processing is displayed so as to be visible to a driver. The blind spot region on the captured image is compressed so that a sudden change of position of a object in a horizontal direction on the captured image is suppressed, as against a change of distance from the vehicle to the object. Compression is performed so that the ratio of transition of position of the object in the horizontal direction on the captured image to transition of distance from the vehicle to the object is substantially the same as the ratio of transition of position of the object in the horizontal direction in the side mirror to transition of distance from the vehicle to the object.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: Disclosed is a device which is mounted on a vehicle, and captures a rear region of a vehicle and a blind spot region outside of a viewing range of a side mirror adjacent to the rear region of the vehicle. A captured image is subjected to image processing so that the blind spot region on the captured image is compressed. The image after subjected to the image processing is displayed so as to be visible to a driver. The blind spot region on the captured image is compressed so that a sudden change of position of a object in a horizontal direction on the captured image is suppressed, as against a change of distance from the vehicle to the object. Compression is performed so that the ratio of transition of position of the object in the horizontal direction on the captured image to transition of distance from the vehicle to the object is substantially the same as the ratio of transition of position of the object in the horizontal direction in the side mirror to transition of distance from the vehicle to the object.

Abstract: A driving assistance system may include a device for obtaining an image of an area behind and next to the present vehicle, the area including a lane other than the present lane; a device for displaying the obtained image so that it is visible to the driver; and a device for superimposing a mark on the image, which indicates degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane. The system may include a mirror for reflecting such an area behind and next to the present vehicle in a manner such that the area is visible to a driver of the present vehicle; and a device for displaying a mark on the mirror, wherein the mark indicates a degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A driving assistance system may include a device for obtaining an image of an area behind and next to the present vehicle, the area including a lane other than the present lane; a device for displaying the obtained image so that it is visible to the driver; and a device for superimposing a mark on the image, which indicates degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane. The system may include a mirror for reflecting such an area behind and next to the present vehicle in a manner such that the area is visible to a driver of the present vehicle; and a device for displaying a mark on the mirror, wherein the mark indicates a degree of danger with respect to another vehicle running on the other lane when the present vehicle enters the other lane.

Abstract: It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.

Abstract: A semiconductor film production apparatus includes a reaction vessel for containing a substrate and including a gas supply port for supplying a reaction gas to the vessel, a gas discharge port for discharging the reaction gas from the vessel after reaction, and a light-transmitting glass window; a light source disposed outside the reaction vessel for irradiating a substrate in the reaction vessel through the light-transmitting glass window to heat the substrate; a cylindrical substrate holder disposed in the reaction vessel for holding the substrate with a first surface facing the light source and a second surface, opposed to the first surface, exposed to the reaction gas; a ring plate having a central opening with an area smaller than the substrate and an outside diameter dividing the reaction vessel into two compartments, the ring plate contacting the first surface of the substrate; a carrier gas supply port for introducing a carrier gas between the substrate and the light-transmitting glass window; and a r

Abstract: Method of forming a thin film on a substrate by CVD (Chemical Vapor Deposition) method and an apparatus therefor, wherein a first gas is supplied from a reaction gas supply port in a reaction chamber, and an active species produced by exciting a second gas are supplied from an active species supply port in the reaction chamber, and a thin film is formed on the substrate by reaction of the first reaction gas and the active species, since a metal porous plate having a number of small holes is installed close to the substrate between the active species supply port and a heater so as to enclose at least the substrate and the active species supply port, the precursor forming reaction is limited to position on the surface of the substrate and diffusion of the precursor to the outer circumferential portion and the inner wall of the reaction chamber is prevented, thereby the low dust producing process to advance the thin film forming reaction is obtained without generating the reaction product of fine particle form w

Abstract: A plurality of connecting wires to be connected to separate devices are arranged regularly and fastened with a string at the front end, the intermediate end and the rear end corresponding to the position of the respective device so as to provide a flat structure including the fastening points in connection with the arrangement in order and the position of each end of the connecting wires so that the wiring can be easily attained to improve productivity; the reading of wiring diagram in the wiring operation is needless by connecting a data card; the flat structure facilitates employment of machines and the combination with a computer allows a fully automatic system. When the connecting wires are bundled, the increase of occupied sectional area is prevented and the occupied sectional area is substantially the same as that of the conventional one. The present invention is suited to the wiring of electric control devices.

Abstract: A connection wire manufacturing system is provided in which a number of pairs of press-connecting terminals are formed in a hoop material, each being coupled at the heads with each other, and the hoop material with the pairs of press-connecting terminals is transferred to a press-connecting step where those pairs of terminals are separated into individual pairs of terminals and those individual ones are press-connected to connection wires with given lengths properly prepared into a continuous connection wire line which is allowed to be taken up by a take-up drum.