Patents by Inventor Tatsuya KAJIWARA

Tatsuya KAJIWARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME
    Publication number: 20240099014
    Abstract: At least one vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate. Rows of backside support pillar structures are formed through the at least one vertically alternating sequence. Memory stack structures are formed through the at least one vertically alternating sequence. A two-dimensional array of discrete backside trenches is formed through the at least one vertically alternating sequence. Contiguous combinations of a subset of the backside trenches and a subset of the backside support pillar structures divide the at least one vertically alternating sequence into alternating stacks of insulating layers and sacrificial material layers. The sacrificial material layers are replaced with electrically conductive layers while the backside support pillar structures provide structural support to the insulating layers.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Shunsuke TAKUMA, Yuji TOTOKI, Seiji SHIMABUKURO, Tatsuya HINOUE, Kengo KAJIWARA, Akihiro TOBIOKA
  • Fracturing method and depressurizing device used for same
    Patent number: 11326433
    Abstract: A fracturing method, to cause a crack in bedrock, includes installing a depressurizing device in a well in the bedrock, and depressurizing the inside of the well with the installed depressurizing device. The installing step includes installing, in the well, a connecting pipe, which is connected to the depressurizing device, and a packer, which is attached to the connecting pipe, and the depressurizing step includes shutting off a gap between the well and the connecting pipe, with the packer, and depressurizing a region in the well below the packer, with the depressurizing device.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 10, 2022
    Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, THE UNIVERSITY OF TOKYO, TOHOKU UNIVERSITY, JMC GEOTHERMAL ENGINEERING CO., LTD., INPEX DRILLING CO., LTD.
    Inventors: Hiroshi Asanuma, Shigemi Naganawa, Noriyoshi Tsuchiya, Tatsuya Kajiwara, Kuniaki Shimada
  • FRACTURING METHOD AND DEPRESSURIZING DEVICE USED FOR SAME
    Publication number: 20210040831
    Abstract: A fracturing method, to cause a crack in bedrock, includes installing a depressurizing device in a well in the bedrock, and depressurizing the inside of the well with the installed depressurizing device. The installing step includes installing, in the well, a connecting pipe, which is connected to the depressurizing device, and a packer, which is attached to the connecting pipe, and the depressurizing step includes shutting off a gap between the well and the connecting pipe, with the packer, and depressurizing a region in the well below the packer, with the depressurizing device.
    Type: Application
    Filed: January 31, 2019
    Publication date: February 11, 2021
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, THE UNIVERSITY OF TOKYO, TOHOKU UNIVERSITY, JMC GEOTHERMAL ENGINEERING CO., LTD.,, TEISEKI DRILLING CO., LTD
    Inventors: Hiroshi ASANUMA, Shigemi NAGANAWA, Noriyoshi TSUCHIYA, Tatsuya KAJIWARA, Kuniaki SHIMADA