Abstract: A pressure sensor module and a dispensing apparatus improving accuracy of pressure measurement are provided. A pressure sensor module includes: a flow channel substrate in which a flow channel and a branch channel are formed; and a distortion detection unit configured to detect a pressure. The branch channel is branched from the flow channel and is connected to the distortion detection unit at one end of the branch channel. The distortion detection unit is disposed at least partially via a bond layer to block the one end of the branch channel. A protrusion is provided to surround the one end of the branch channel.

Abstract: Provided is a liquid resin composition superior in flatness after screen printing, stability in B stage, adhesiveness to a dicing tape, dicing property and adhesion to a lead frame. The liquid resin composition comprises given amounts of (A) an epoxy resin having not less than two epoxy groups in one molecule; (B) a curing agent having not less than two groups in one molecule that are reactive with epoxy groups; (C) an acrylic resin; (D) a curing agent; (E) an inorganic filler; (F) a diluent; and (G) a dimethyl silicone.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.

Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) [{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5  (2) wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2):

Abstract: A light-transmissive epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler satisfies formula (1):

Abstract: A zinc-base galvanized sheet steel which comprises zinc-base plated sheet steel and, formed on the plating layer surface, an inorganic covering layer which contains at least one inorganic oxide in an amount of 1-500 mg/m.sup.2 in terms of the weight of metallic elements exclusive of oxygen and optionally contains at least one oxoacid or inorganic oxide colloid in an amount of 1-500 mg/m.sup.2 and further, as desired for improving weldability, a Zn oxide film formed between the inorganic covering layer and the zinc-base plating layer, and the process for producing said galvanized sheet steel.

Abstract: A galvannealed steel sheet having distinguished anti-powdering property and anti-flaking property is disclosed. The steel sheet comprises a matrix steel sheet and a galvannealed coating layer having a coating weight of 45 to 90 g/m.sup.2, composed of 8.about.12 wt. % Fe and 0.05.about.0.35 wt. %, preferably 0.05.about.0.30 wt. % Al, the balance being Zn, provided on at least one side of the matrix steel sheet, the galvannealed coating layer having a .GAMMA. phase with a thickness of not more than 1.3 .mu.m, preferably not more than 1.0 .mu.m in the region at the boundary to the matrix steel sheet, and the surface region of galvannealed coating layer has a structure either (1) .eta. and .zeta. phases do not exist in the surface region of the galvannealed coating layer, or, (2) when at least one of .eta. and .zeta. phases exist therein, the total amount of the at least one of .eta. and .zeta. phases in the galvannealed coating layer is not more than 1.5 g/m.sup.2.

Abstract: A plated steel strip having an enhanced corrosion and rust resistance and an improved paint-coating property comprises a principal plating layer formed on a steel strip substrate and comprising a co-deposited zinc-chromium based alloy which comprises more than 5% by weight but not more than 40% by weight of chromium and the balance of zinc.

Abstract: A plated steel strip having an enhanced corrosion and rust resistance and an improved paint-coating property comprises a principal plating layer formed on a steel strip substrate and comprising a co-deposited zinc-chromium based alloy which comprises more than 5% by weight but not more than 40% by weight of chromium and the balance of zinc.

Abstract: A metallic material is electroplated with an iron-zinc alloy with an improved efficiency by using an insoluble anode and an electroplating liquid containing, in addition to necessary amounts of zinc and ferrous ions, 0.01 to 10 g/l of an additive consisting of at least one member selected from oxyalkylene compounds of the formulae (I) to (VIII), ##STR1## and ##STR2## wherein n, n.sup.1 or n.sup.5 =1 to 200,n.sup.2 or n.sup.6 =6 to 2000,n.sup.3 or n.sup.7 =4 to 2000,n.sup.4 =2 to 2000,R or R.sup.3 =alkyl (C.sub.1 -C.sub.20)R.sup.1, R.sup.2, R.sup.4 or R.sup.5 =H or alkyl (C.sub.1 -C.sub.2)and sulfation products of the above-mentioned compounds.