Abstract: A light-emitting module includes: first and second light-emitting devices each including semiconductor laser elements that emit laser beams with an interval in a slow axis direction of the laser beams; a first optical unit that includes one or more first reflective members provided with reflective surfaces on which laser beams are incident and that makes the interval of the laser beams smaller and emits the laser beams; a second optical unit that includes second reflective members provided with reflective surfaces on which laser beams are incident and that reflects, two times or more, laser beams emitted with an interval in a fast axis direction and emits the laser beams with a smaller interval and with a smaller width in the fast axis direction of the laser beams; and a condenser lens that gathers laser beams having traveled through the first optical unit and the second optical unit.

Abstract: Provided is a galvanized steel sheet having a TS of 980 MPa or more, high YS, excellent ductility, strain hardenability, and hole expansion formability. A base steel sheet has a defined chemical composition and a steel microstructure as follows: area ratio of ferrite: 65.0% or less (including 0%), area ratio of bainitic ferrite: 5.0% or more and 40.0% or less, area ratio of tempered martensite: 0.5% or more and 80.0% or less, area ratio of retained austenite: 3.0% or more, area ratio of fresh martensite: 20.0% or less (including 0%), SBF+STM+2×SMA: 65.0% or more, SMA1/SMA: 0.80 or less, and SMA2/SMA: 0.20 or more.

Abstract: A film forming method includes preparing a substrate having an amorphous silicon film on a surface thereof, diffusing nickel into the amorphous silicon film by supplying a nickel source gas to the amorphous silicon film, and forming a polycrystalline silicon film by heating the amorphous silicon film, and crystallizing the amorphous silicon film by metal-induced lateral crystallization using the nickel diffused in the amorphous silicon film as a nucleus.

Abstract: A light-emitting device includes: a light-emitting element; a package in which the light-emitting element is arranged; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the light-emitting element exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

Abstract: A light emitting device includes a base, a first semiconductor laser element, a second semiconductor laser element, a lens member, and a waveplate. The base has a bottom part. The first semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element has a different polarization direction from a polarization direction of the first semiconductor laser element. The lens member is a member into which light beams from the first semiconductor element and the second semiconductor laser element enter. The waveplate is configured to change the polarization direction of light from the first semiconductor laser element.

Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.

Abstract: A light source device, including: a reflective member including a plurality of reflective surfaces including a first reflective surface and a second reflective surface, and one or more transmissive surfaces including a first transmissive surface that connects between the first reflective surface and the second reflective surface; a plurality of light-emitting elements including a first light-emitting element emitting first light that travels in a direction in which the reflective member is arranged to be incident on the first reflective surface, and a second light-emitting element emitting second light that travels in a direction in which the reflective member is arranged to be incident on the second reflective surface; and a first photodetector having a first light-receiving surface on which the first light that travels in the direction in which the reflective member is arranged and is transmitted through the first transmissive surface is irradiated.

Abstract: A light source device includes: light-emitting portions arranged at least along an arrangement direction; one or more optical members including a first reflective surface and a second reflective surface, and configured to reflect light emitted from the plurality of light-emitting portions and emit the light in a predetermined direction; and a condenser lens configured to condense the light emitted from the one or more optical members. The first reflective surface is configured to reflect the light emitted from the plurality of light-emitting portions toward the second reflective surface. The second reflective surface is configured to reflect the light reflected by the first reflective surface. Each of the first reflective surface and the second reflective surface is a surface having a curvature in the arrangement direction. The curvature of the second reflective surface in the arrangement direction is greater than the curvature of the first reflective surface in the arrangement direction.

Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.

Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

Abstract: A light-emitting device includes light-emitting elements to emit first and second lights; a package having a disposition surface on which the light-emitting elements are disposed and a light extracting surface through which the first and second lights are to be emitted; a wave plate bonded to the light extracting surface of the package at a position on which a main portion of the first light is to be incident and a main portion of the second light is not to be incident; a lens member having an incidence surface on which the first light transmitted through the wave plate and the second light emitted from the light extracting surface are to be incident; and bonding parts disposed between the package and the lens member. The wave plate is disposed between the package and the lens member without being in contact with the lens member.

Abstract: A light emitting device includes a base, a first semiconductor laser element, a second semiconductor laser element, a lens member, and a waveplate. The base has a bottom part. The first semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element has a different polarization direction from a polarization direction of the first semiconductor laser element. The lens member is a member into which light beams from the first semiconductor element and the second semiconductor laser element enter. The waveplate is configured to change the polarization direction of light from the first semiconductor laser element.

Abstract: A light emitting device includes a base having a bottom part, a first semiconductor laser element disposed on the bottom part of the base, and a first light reflecting member disposed on the bottom part of the base. The first light reflecting member has a light reflecting surface configured to reflect light emitted from the first semiconductor laser element. The light reflecting surface of the first light reflecting member is a curved surface configured such that, with respect to the major portion of the light emitted from the first semiconductor laser element, the beam divergence angle of the light reflected by the light reflecting surface is greater than zero and smaller than the beam divergence angle of the light irradiating the light reflecting surface.

Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

Abstract: A light emitting device includes a base having a bottom part, a first semiconductor laser element disposed on the bottom part of the base, and a first light reflecting member disposed on the bottom part of the base. The first light reflecting member has a light reflecting surface configured to reflect light emitted from the first semiconductor laser element. The light reflecting surface of the first light reflecting member is a curved surface configured such that, with respect to the major portion of the light emitted from the first semiconductor laser element, the beam divergence angle of the light reflected by the light reflecting surface is greater than zero and smaller than the beam divergence angle of the light irradiating the light reflecting surface.

Abstract: A light emitting device includes a base, a frame, one or more semiconductor laser elements, a cover member, an optical member fixed to the cover member via an adhesive member, and a pressing member. The adhesive member includes one or more first adhesive portion disposed between an upper surface of the cover member and a lower surface of the optical member, and two or more second adhesive portions respectively disposed at locations in contact with or spaced apart from the one or more first adhesive portions when viewed from above, in contact with the first inner lateral surface of the cover member and the lateral surface of the optical member.

Abstract: A light emitting device includes a base, a frame, one or more semiconductor laser elements, a cover member, an optical member fixed to the cover member via an adhesive member, and a pressing member. The adhesive member includes one or more first adhesive portion disposed between an upper surface of the cover member and a lower surface of the optical member, and two or more second adhesive portions respectively disposed at locations in contact with or spaced apart from the one or more first adhesive portions when viewed from above, in contact with the first inner lateral surface of the cover member and the lateral surface of the optical member.

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.