Patents by Inventor Tatsuya Kariyasu

Tatsuya Kariyasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste
    Patent number: 9721694
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: August 1, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • FINE SILVER PARTICLE POWDER, METHOD FOR MANUFACTURING THE SAME, SILVER PASTE USING THE POWDER AND METHOD OF USE OF THE PASTE
    Publication number: 20150243400
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: April 3, 2015
    Publication date: August 27, 2015
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Shuji KANEDA, Kimikazu MOTOMURA, Tatsuya KARIYASU, Yutaka HISAEDA, Kosuke IHA
  • Fine silver particle powder, method for manufacturing the same, silver paste using the powder, and method of use of the paste
    Patent number: 9034214
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: May 19, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • FINE SILVER PARTICLE POWDER, METHOD FOR MANUFACTURING THE SAME, SILVER PASTE USING THE POWDER, AND METHOD OF USE OF THE PASTE
    Publication number: 20110253949
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: December 25, 2009
    Publication date: October 20, 2011
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha