Abstract: A powder container includes a powder chamber for containing powder for forming images, a powder outlet formed in a face of the powder container, and a shutter assembly to open and close the powder outlet and including first and second shutters. The first shutter is movable between a sealing position to close the powder outlet and an open position to open the powder outlet and includes a pressed member to cancel retention of the first shutter at the sealing position. The second shutter includes a pressing projection that interferes with the pressed member of the first shutter and is movable between a shielding position to cover the pressed member without interference between the pressing projection and the pressed member and a releasing position to press the pressed member with the pressing projection.

Abstract: An internal combustion engine to which a controller is applied includes a cylinder, a turbocharger, an intake passage, a throttle valve, and an exhaust passage. The turbocharger includes a turbine wheel, a compressor wheel, and a wastegate valve. The controller executes a loss estimating process that calculates an estimated value of a pumping loss of the internal combustion engine from an intake air pressure, which is air pressure at a downstream side of the throttle valve in the intake passage, an engine speed of the internal combustion engine, and a charging pressure.

Abstract: To provide a resin composition having high relative permittivity, while keeping low loss tangent, and excellent mechanical strength; a molded article; and a method for manufacturing a plated molded article. A resin composition comprising: per 100 parts by mass of a thermoplastic resin, 0.3 to 10 parts by mass an acid-modified polymer; 5 to 150 parts by mass of a laser direct structuring additive; and 10 to 150 parts by mass of a reinforcing fiber, the laser direct structuring additive being a compound being a conductive oxide having a resistivity of 5×103 ?·cm or smaller, and containing at least one type selected from a Group n (n represents an integer of 3 to 16) metal in the periodic table and a Group n+1 metal, or, calcium copper titanate.

Abstract: An aluminum member (1) includes: a base material (2) composed of aluminum or an aluminum alloy; and an anodic oxide film (3) formed on a surface of the base material. The anodic oxide film includes: an amorphous layer (31), which is composed of an amorphous aluminum oxide and is formed on the base material (2); and a crystal layer (32), which is composed of a crystalline aluminum oxide and is formed on the amorphous layer (31). The aluminum member (1) can be obtained by forming the anodic oxide film (3) on the base material (2) by performing an anodization process on the base material (2) in an electrolytic solution, which contains boron atoms and has a pH of 7.0-12.0.

Abstract: Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R1 and R2 independently represents a hydrogen atom or a methyl group, and W1 represents a single bond or a divalent group).

Abstract: Provided is a resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher, having low loss tangent, and, an electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher. The resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher contains a polycarbonate resin, and the polycarbonate resin having a mass ratio of a structural unit represented by formula (1) and a carbonate unit other than the structural unit represented by formula (1) of (33 to 100):(67 to 0), in formula (1), each of R1 and R2 independently represents a hydrogen atom or a methyl group, and W1 represents a single bond or a divalent group.

Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.

Abstract: There is provided a cover for a millimeter-wave radar, the cover being provided on an antenna that transmits and/or receives a millimeter wave of 75 to 81 GHz, the cover containing a thermoplastic resin composition that contains an aromatic polycarbonate resin having a structural unit (A) represented by formula (1) below, the cover having a relative dielectric constant ?r of 3.0 or less, a dielectric loss tangent tan ? of 8.0×10?3 or less, and a loss factor ?r·tan ? of 17.0×10?3 or less: where in formula (1), R1 and R2 are each a hydrogen atom or a methyl group, and W1 is at least one selected from a single bond, an oxygen atom, a sulfur atom, and a divalent organic group.

Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.

Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

Abstract: To form a plated layer on a surface of the resin molded article without adding the LDS additive to the thermoplastic resin composition. The laser direct structuring layer-forming composition contains a curable compound, an organic solvent, and a laser direct structuring additive.

Abstract: Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 ?·cm or less.

Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract: Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 ?·cm or less.

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer-interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract: A multilayer ceramic electronic component comprising an element body in which a dielectric layer and an internal electrode layer are stacked. The dielectric layer is constituted from a dielectric ceramic composition including; a compound having a perovskite structure expressed by a formula of ABO3 (A is at least one selected from Ba, Ca, and Sr; B is at least one selected from Ti, Zr, and Hf); an oxide of Mg; an oxide of rare earth elements including Sc and Y; and an oxide including Si. The dielectric ceramic composition comprises a plurality of dielectric particles and a grain boundary present in between the dielectric particles. In the grain boundary, when content ratios of Mg and Si are set to D(Mg) and D(Si) respectively, D(Mg) is 0.2 to 1.8 wt % in terms of MgO, and D(Si) is 0.4 to 8.0 wt % in terms of SiO2.

Abstract: A multilayer ceramic electronic component comprising an element body in which a dielectric layer and an internal electrode layer are stacked. The dielectric layer is constituted from a dielectric ceramic composition including; a compound having a perovskite structure expressed by a formula of ABO3 (A is at least one selected from Ba, Ca, and Sr; B is at least one selected from Ti, Zr, and Hf); an oxide of Mg; an oxide of rare earth elements including Sc and Y; and an oxide including Si. The dielectric ceramic composition comprises a plurality of dielectric particles and a grain boundary present in between the dielectric particles. In the grain boundary, when content ratios of Mg and Si are set to D(Mg) and D(Si) respectively, D(Mg) is 0.2 to 1.8 wt % in terms of MgO, and D(Si) is 0.4 to 8.0 wt % in terms of SiO2.

Abstract: To provide a high-thermal-conductivity polycarbonate resin composition that has further improved thermal conductivity and even insulating properties and flame resistance, and a formed product thereof. A high-thermal-conductivity polycarbonate resin composition, containing: 100 parts by mass of an (A) resin component mainly composed of a polycarbonate resin; 5 parts by mass or more and 100 parts by mass or less of (B) graphitized carbon fiber having a longitudinal thermal conductivity of 100 W/m K or more and an average fiber diameter in the range of 5 to 20 ?m; and 5 parts by mass or more and 200 parts by mass or less of glass beads having an average particle size in the range of 1 to 100 ?m and a sphericity in the range of 1 to 2.

Abstract: An N-alkylpiperidine methanethiol ester derivative represented by any one of the general formulae (1) to (4) or a salt thereof has been discovered. The N-alkylpiperidine methanethiol ester derivative or the salt thereof has specificity for acetylcholinesterase or butyrylcholinesterase and is useful as a reagent for measurement of cholinesterase activity by the Ellman method.