Abstract: Provided is an epoxy resin composition that, although it can be cured even at a low temperature, can form a cured product having excellent impact resistance and has excellent adhesive strength. Specifically, provided is an epoxy resin composition containing: (A) an epoxy resin which is liquid at 25° C.; (B) an epoxy resin which is solid at 25° C.; (C) a rubber-modified epoxy resin (excluding the (A) and the (B)); (D) a blocked urethane resin; (E) a spherical inorganic filler having an average particle size of 0.1 ?m to 150 ?m; (F) an organic filler; and (G) a latent curing agent.

Abstract: In developing epoxy resin compositions used as an adhesive for structure (structural adhesive) required to have adhesive properties, if each component is increased to further enhance the adhesive properties such as shear bond strength and peel strength, this causes problems, for example, as follows. The viscosity becomes so high that the workability deteriorates. Hence, the added amount has to be limited. Moreover, the cured product becomes excessively flexible, so that the shear bond strength deteriorates. An epoxy resin composition contains the following components (A) to (E), where the component (A) does not include the component (C): the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.

Abstract: In developing epoxy resin compositions used as an adhesive for structure (structural adhesive) required to have adhesive properties, if each component is increased to further enhance the adhesive properties such as shear bond strength and peel strength, this causes problems, for example, as follows. The viscosity becomes so high that the workability deteriorates. Hence, the added amount has to be limited. Moreover, the cured product becomes excessively flexible, so that the shear bond strength deteriorates. An epoxy resin composition contains the following components (A) to (E), where the component (A) does not include the component (C): the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.