Abstract: Provided is a lighting device using semiconductor laser elements that can be safely used even in a cold region etc. The present invention includes: a plurality of semiconductor laser elements; a temperature sensor that measures an ambient temperature of the plurality of semiconductor laser elements; and a current controller that controls current supply to the semiconductor laser elements, wherein, when a measured value from the temperature sensor is equal to or less than a predetermined first threshold temperature, the current controller does not supply a current equal to or greater than a threshold current, which is required to emit laser light, to the semiconductor laser elements until the measured value exceeds the first threshold temperature, and when the measured value exceeds the first threshold temperature, the current controller supplies a current equal to or greater than the threshold current to the semiconductor laser elements.

Abstract: An illumination system includes an illumination base. The illumination base has two common lines, a plurality of parallel branching lines extending between the common lines respectively, and a plurality of sockets disposed on the branching lines. The same number of sockets are disposed on each branching line, and the sockets are connected in series. The illumination system also includes light source elements. Each light source element has a first plug portion to be received in one of the sockets, and an LED lamp to be electrically connected to the illumination base when the first plug portion is received in the associated socket. The illumination system also includes resistor elements. Each resistor element has a second plug portion to be received in one of the sockets, and a resistor to be electrically connected to the illumination base when the second plug portion is received in the associated socket.

Abstract: An illumination system includes an illumination base. The illumination base has two common lines, a plurality of parallel branching lines extending between the common lines respectively, and a plurality of sockets disposed on the branching lines. The same number of sockets are disposed on each branching line, and the sockets are connected in series. The illumination system also includes light source elements. Each light source element has a first plug portion to be received in one of the sockets, and an LED lamp to be electrically connected to the illumination base when the first plug portion is received in the associated socket. The illumination system also includes resistor elements. Each resistor element has a second plug portion to be received in one of the sockets, and a resistor to be electrically connected to the illumination base when the second plug portion is received in the associated socket.

Abstract: Provided are a light emitting module and a manufacturing method thereof, the light emitting module having improved heat radiation properties and improved adhesion between a sealing resin for sealing a light emitting element and other members. A light emitting module 10 includes: a metal substrate 12; a concave part 18 provided by partially denting an upper surface of the metal substrate 12; a light emitting element 20 accommodated in the concave part 18; and a sealing resin 32 covering the light emitting element 20. A convex part 11 is further provided on the upper surface of the metal substrate 40 in a region thereof surrounding the concave part 18. The sealing resin 32 is allowed to adhere to the convex part 11, thereby improving adhesion strength between the sealing resin 32 and the metal substrate 12.

Abstract: A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

Abstract: Provided are: a light emitting module capable of ensuring a high heat-dissipating property and mountable in any of sets in various shapes; and a method for manufacturing the light emitting module. The light emitting module mainly includes: a metal substrate; an insulating layer covering the upper surface of the metal substrate; a conductive pattern formed on the upper surface of the insulating layer; and a light emitting element fixedly attached to the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, a groove is formed in the metal substrate, and then the metal substrate is bent. Thus, a bent portion is formed in the metal substrate.

Abstract: A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

Abstract: Grooves are formed along the length inside a frame member formed by integrating a lens and reflecting frames. A base plate on which light emitting diodes are arranged in a line is held in the frame member by being inserted in the grooves. The lower part of the frame member is open so that heat is released directly from the base plate, thereby preventing the warp of the base plate and the frame member due to an increase in temperature.

Abstract: According to the present invention, a resin molded product provided with engaging projections to be engaged with engaging members, which have been previously formed in side walls of a frame member, and wing members to be in contact with top portions of the side walls of the frame member alternately formed on the side walls thereof is used as a rod lens of the linear light source. Thus, a curvature of the rod lens can be optionally selected and the linear light source is superior also in assembling. In addition, in the case where this rod lens is composed of a lens surface covering a width of opening of the frame member and an almost flat counter surface positioned opposite to this lens surface, a light-scattering effect is brought about in the counter surface of the rod lens by taking a refractive index or a thickness of this rod lens into consideration, whereby a width of illumination can be increased.