Abstract: A solid-state imaging element having an array of light receiving pixels is disclosed. A light receiving pixel includes a pair of photoelectric conversion units, a first separation region, and a second separation region. The pair of photoelectric conversion units is disposed adjacent to each other and has a shared floating diffusion (FD). The first separation region surrounds the pair of photoelectric conversion units. The second separation region is disposed between the pair of photoelectric conversion units. The first separation region has a rectangular shape in plan view and extends from a surface on the opposite side to a light incident surface of the semiconductor layer toward the light incident surface. The second separation region is disposed along a diagonal line of the first separation region extends from the surface on the opposite side to the light incident surface of the semiconductor layer toward the light incident surface.

Abstract: To downsize an imaging element formed by stacking a plurality of semiconductor substrates. The imaging element includes pixels, a pixel circuit, an isolating section, a buried electrode, and a connecting location. Each of the pixels includes: a photoelectric conversion section on the first semiconductor substrate; a charge holding section that holds a charge generated by the photoelectric conversion section; and a charge transfer section. The pixel circuit generates an image signal on the basis of charges disposed and held on a second semiconductor substrate stacked on the front surface side of the first semiconductor substrate. The isolating section is disposed at a boundary of the pixels. The buried electrode is disposed at the boundary of the pixel overlapping the isolating section, so as to be connected to the first semiconductor substrate. The connecting location is connected to the buried electrode.

Abstract: Color mixing between pixels of different colors is suppressed. A solid-state imaging device includes: a semiconductor layer including a plurality of photoelectric conversion sections partitioned by an isolation region; a shared on-chip lens arranged on a light incident surface side of the semiconductor layer, the shared on-chip lens being shared by the photoelectric conversion sections adjacent to each other with the isolation region interposed between the photoelectric conversion sections, and having a condensing point positioned in the isolation region; and a concave portion provided in an upper portion of the photoelectric conversion sections that share the shared on-chip lens on the light incident surface of the semiconductor layer.

Abstract: The present invention relates to an arc-extinguishing insulation material molded product provided in the vicinity of a contact point between contactors in a gas circuit breaker. The arc-extinguishing insulation material molded product includes a polymer which contains a carbon-oxygen bond in the main chain, and in which a part of or all of terminal atoms are non-hydrogen atoms.

Abstract: The present invention relates to an arc-extinguishing insulation material molded product provided in the vicinity of a contact point between contactors in a gas circuit breaker. The arc-extinguishing insulation material molded product includes a polymer which contains a carbon-oxygen bond in the main chain, and in which a part of or all of terminal atoms are non-hydrogen atoms.

Abstract: A gas insulated switchgear includes a high-voltage conductor installed inside a ground tank filled with an insulation gas and the high-voltage conductor is supported on an insulation spacer and thereby fixed to the ground tank. The gas insulator switchgear is configured in such a manner that an insulation portion of the insulation spacer in contact with the insulation gas is covered with a cover film formed by hardening powder of any of thermoplastic resin, glass, cellulose, and polymer resin made of carbon and hydrogen having a particle size of 100 ?m or less with epoxy resin.

Abstract: The present invention relates to an arc-extinguishing insulation material molded product provided in the vicinity of a contact point between contactors in a gas circuit breaker. The arc-extinguishing insulation material molded product includes a polymer which contains a carbon-oxygen bond in the main chain, and in which a part of or all of terminal atoms are non-hydrogen atoms.

Abstract: Provided is a method of producing a fiber-reinforced composite material, involving impregnating a fiber structure with a resin by using the pressure difference between a vacuum pressure and an atmospheric pressure and thereafter curing the resin, the method comprising: impregnating a mixture of a bromine-containing resin 22 and a powdered flame retardant 21 that contains at least one component selected from aluminum hydroxide and magnesium hydroxide and has an average particle size in the range of 0.1 to 20 ?m into a fiber structure 10 that has a mode value for the size of fiber surrounded individual openings in the range of 0.03 to 3 mm2 and an opening area percentage in the range of 0.1 to 10%, from a surface direction of the fiber structure 10, to unevenly distribute the powdered flame retardant 21 in a surface layer of the fiber structure 10. The present invention can simply and conveniently produce a highly flame-retardant and lightweight fiber-reinforced composite material that exhibits a high strength.

Abstract: A gas insulated switchgear includes a high-voltage conductor installed inside a ground tank filled with an insulation gas and the high-voltage conductor is supported on an insulation spacer and thereby fixed to the ground tank. The gas insulator switchgear is configured in such a manner that an insulation portion of the insulation spacer in contact with the insulation gas is covered with a cover film formed by hardening powder of any of thermoplastic resin, glass, cellulose, and polymer resin made of carbon and hydrogen having a particle size of 100 ?m or less with epoxy resin.

Abstract: A splashproof construction for a portable electronic device, comprising an electronic device main unit, and a battery pack to be mounted on the electronic device main unit, whereby one of either the electronic device main unit or the battery pack has a boundary surface formed along a combined surface and a peripheral edge and with a graded step with respect to the combined surface, and a guide rail provided adjacent to the boundary surface, and the other of either the electronic device main unit or the battery pack has a peripheral wall aligned with the boundary surface and a guide groove to be slidably engaged with the guide rail, or a bottom wall of the peripheral wall has a notch abutting on a lower surface of the graded step on the boundary surface, or a water-repellent sheet is provided at the bottom of the guide groove, or a seal plate made of a highly elastic material is provided either on an end surface of the battery pack abutted on the electronic device main unit at an end point of sliding when the