Patents by Inventor Tatsuya Okunishi

Tatsuya Okunishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6727591
    Abstract: It is intended to provide multi-piece circuit boards capable of preventing lowering of strength of joint sections between piece sections after cutoff and other sections, and determining material of flame sections regardless of material of a piece section, and board manufacturing method of such multi-piece circuit boards. For a mixed board including a defective piece section and a good piece section in a state in which an outermost layer is not formed yet, cut lines are made around bridges and are joined together by adhesive, and an upper layer is provided thereon, whereby a multi-piece circuit board mounted on good piece sections only is formed. A frame section may be formed by arranging respective piece sections manufactured in advance at positions at which the piece sections are to be present and injecting fluid matter to surround the respective piece sections arranged to form the frame section.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: April 27, 2004
    Assignee: Ibiden Co., Ltd.
    Inventors: Makoto Yanase, Katsumi Sagisaka, Isao Shimada, Tatsuya Okunishi
  • Publication number: 20030178725
    Abstract: It is intended to provide multi-piece circuit boards capable of preventing lowering of strength of joint sections between piece sections after cutoff and other sections, and determining material of flame sections regardless of material of a piece section, and board manufacturing method of such multi-piece circuit boards. For a mixed board including a defective piece section and a good piece section in a state in which an outermost layer is not formed yet, cut lines are made around bridges and are joined together by adhesive, and an upper layer is provided thereon, whereby a multi-piece circuit board mounted on good piece sections only is formed. A frame section may be formed by arranging respective piece sections manufactured in advance at positions at which the piece sections are to be present and injecting fluid matter to surround the respective piece sections arranged to form the frame section.
    Type: Application
    Filed: December 19, 2002
    Publication date: September 25, 2003
    Inventors: Makoto Yanase, Katsumi Sagisaka, Isao Shimada, Tatsuya Okunishi