Patents by Inventor Tatsuya OOUE

Tatsuya OOUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11558967
    Abstract: Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: January 17, 2023
    Assignee: DIAMOND & ZEBRA ELECTRIC MFG. CO., LTD.
    Inventors: Yuuki Ookado, Tatsuya Ooue, Hiroki Nakata
  • Patent number: 11147173
    Abstract: An electronic device includes a housing, a circuit substrate, a connector, and a seal obtained by a sealant having fluidity being hardened. The housing includes a lower case and an upper case that covers the lower case. The connector is disposed between the upper case and the lower case. The lower case has a case groove. A connector projection disposed on the connector and a case projection disposed on the upper case are fitted into the case groove. The connector includes a connector groove, and the case projection is fitted into the connector groove. An obstructor for inhibiting flow of the sealant is disposed in the case groove or the connector groove.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: October 12, 2021
    Assignee: DIAMOND ELECTRIC MFG. CO., LTD.
    Inventors: Tatsuya Ooue, Hiroki Nakata
  • Publication number: 20210014984
    Abstract: Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.
    Type: Application
    Filed: March 23, 2020
    Publication date: January 14, 2021
    Inventors: Yuuki OOKADO, Tatsuya OOUE, Hiroki NAKATA
  • Publication number: 20200367372
    Abstract: An electronic device includes a housing, a circuit substrate, a connector, and a seal obtained by a sealant having fluidity being hardened. The housing includes a lower case and an upper case that covers the lower case. The connector is disposed between the upper case and the lower case. The lower case has a case groove. A connector projection disposed on the connector and a case projection disposed on the upper case are fitted into the case groove. The connector includes a connector groove, and the case projection is fitted into the connector groove. An obstructor for inhibiting flow of the sealant is disposed in the case groove or the connector groove.
    Type: Application
    Filed: March 30, 2020
    Publication date: November 19, 2020
    Applicant: DIAMOND ELECTRIC MFG. CO., LTD.
    Inventors: Tatsuya OOUE, Hiroki NAKATA