Patents by Inventor Tatsuya OSADA

Tatsuya OSADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for inspecting back surface of epitaxial wafer and method of inspecting back surface of epitaxial wafer using the same
    Patent number: 10338005
    Abstract: Provided is an apparatus for inspecting the back surface of an epitaxial wafer, capable of detecting defects in the back surface of an epitaxial wafer. An epitaxial wafer back surface inspection apparatus has an optical system including an annular fiber optic illuminator and an imaging unit which are placed perpendicular to the back surface of an epitaxial wafer; and a scanning unit operating the optical system in parallel with the back surface to scan the back surface. A light source of the annular fiber optic illuminator is composed of either blue LEDs or red LEDs.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: July 2, 2019
    Assignee: SUMCO CORPORATION
    Inventors: Tatsuya Osada, Hideaki Kinbara, Masahiko Egashira
  • Wafer inspection method and wafer inspection apparatus
    Patent number: 10161883
    Abstract: Provided is a wafer inspection method capable of examining whether pits are formed in wafer surfaces. The wafer inspection method includes the steps of: choosing defects of a wafer using a first optical system; selecting potential pits from the chosen defects; and classifying the potential pits into pits and defects other than the pits using a second optical system.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: December 25, 2018
    Assignee: SUMCO CORPORATION
    Inventors: Tatsuya Osada, Masahiko Egashira, Tomokatsu Uchino
  • WAFER INSPECTION METHOD AND WAFER INSPECTION APPARATUS
    Publication number: 20180328859
    Abstract: Provided is a wafer inspection method capable of examining whether pits are formed in wafer surfaces. The wafer inspection method includes the steps of: choosing defects of a wafer using a first optical system; selecting potential pits from the chosen defects; and classifying the potential pits into pits and defects other than the pits using a second optical system.
    Type: Application
    Filed: August 3, 2016
    Publication date: November 15, 2018
    Applicants: SUMCO CORPORATION, SUMCO CORPORATION
    Inventors: Tatsuya OSADA, Masahiko EGASHIRA, Tomokatsu UCHINO
  • APPARATUS FOR INSPECTING BACK SURFACE OF EPITAXIAL WAFER AND METHOD OF INSPECTING BACK SURFACE OF EPITAXIAL WAFER USING THE SAME
    Publication number: 20180306731
    Abstract: Provided is an apparatus for inspecting the back surface of an epitaxial wafer, capable of detecting defects in the back surface of an epitaxial wafer. An epitaxial wafer back surface inspection apparatus has an optical system including an annular fiber optic illuminator and an imaging unit which are placed perpendicular to the back surface of an epitaxial wafer; and a scanning unit operating the optical system in parallel with the back surface to scan the back surface. A light source of the annular fiber optic illuminator is composed of either blue LEDs or red LEDs.
    Type: Application
    Filed: August 3, 2016
    Publication date: October 25, 2018
    Applicant: SUMCO CORPORATION
    Inventors: Tatsuya OSADA, Hideaki KINBARA, Masahiko EGASHIRA