Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.

Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

Abstract: A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.

Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

Abstract: A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.

Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: A novel light-emitting device that is highly convenient or reliable is provided. A method for manufacturing a novel light-emitting device that is highly convenient or reliable is also provided. Further, a novel light-emitting device, a method for manufacturing a novel light-emitting device, or a novel device is provided. The present inventor has conceived the structure in which a first insulating film and a light-emitting element are provided between a first support having certain isotropy and a second support.

Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.

Abstract: A novel light-emitting device that is highly convenient or reliable is provided. A method for manufacturing a novel light-emitting device that is highly convenient or reliable is also provided. Further, a novel light-emitting device, a method for manufacturing a novel light-emitting device, or a novel device is provided. The present inventor has conceived the structure in which a first insulating film and a light-emitting element are provided between a first support having certain isotropy and a second support.

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.

Abstract: A novel light-emitting device that is highly convenient or reliable is provided. A method for manufacturing a novel light-emitting device that is highly convenient or reliable is also provided. Further, a novel light-emitting device, a method for manufacturing a novel light-emitting device, or a novel device is provided. The present inventor has conceived the structure in which a first insulating film and a light-emitting element are provided between a first support having certain isotropy and a second support.

Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.