Patents by Inventor Tatsuya Senba

Tatsuya Senba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110192531
    Abstract: An RTM molding method and device includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and injecting resin to complete molding, wherein divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas to introduce injected resin into the respective divided areas. When a relatively large molded product is molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby producing a high-quality molded product with a shortened molding time and increased production speed and volume.
    Type: Application
    Filed: April 1, 2011
    Publication date: August 11, 2011
    Applicant: Toray Industries, Inc.
    Inventors: Toshihide SEKIDO, Shigeo IWASAWA, Tatsuya SENBA
  • Patent number: 7943078
    Abstract: An RTM molding method includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: May 17, 2011
    Assignee: Toray Industries, Inc.
    Inventors: Toshihide Sekido, Shigeo Iwasawa, Tatsuya Senba
  • Publication number: 20070182071
    Abstract: An RTM molding method comprising disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc.
    Type: Application
    Filed: February 16, 2005
    Publication date: August 9, 2007
    Inventors: Toshihide Sekido, Shigeo Iwasawa, Tatsuya Senba