Abstract: A power semiconductor module comprises a metal base, plural wiring substrates provided on said the base, a first wiring substrate of the wiring substrates having a power circuit portion including a power semiconductor device, and substrate containing portions having a resin portion in which one of the wiring substrates is contained. The one of the wiring substrates is positioned in self-alignment on the metal substrate on the basis of an inner wall of the resin portion of the substrate-containing portion.

Abstract: A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.

Abstract: A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.

Abstract: A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.

Abstract: A power semiconductor module comprises a metal base, plural wiring substrates provided on said the base, a first wiring substrate of the wiring substrates having a power circuit portion including a power semiconductor device, and substrate containing portions having a resin portion in which one of the wiring substrates is contained. The one of the wiring substrates is positioned in self-alignment on the metal substrate on the basis of an inner wall of the resin portion of the substrate-containing portion.

Abstract: A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.

Abstract: A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

Abstract: A tape loading mechanism used in a recording and reproducing apparatus for extracting a tape from a cassette and for winding it on a tape guide drum on which a rotating head for recording information on or reproducing information from the tape is mounted. A guide base, on which a group of guides for extracting the tape from the cassette are mounted, is rotatably supported by a shaft on a drive member that drives the guide base. An attitude control member is installed along the path of travel of the guide base to engage with the sides of the guide base to control the rotating angle of the latter.

Abstract: A tape loading mechanism used in a recording and reproducing apparatus for extracting a tape from a cassette and for winding it on a tape guide drum on which a rotating head for recording information on or reproducing information from the tape is mounted. A guide base, on which a group of guides for extracting the tape from the cassette are mounted, is rotatably supported by a shaft on a drive member that drives the guide base. An attitude control member is installed along the path of travel of the guide base to engage with the sides of the guide base to control the rotating angle of the latter.

Abstract: An arc cam member has a guide groove formed on its underside along its arced length. On its outer circumference, the cam member is provided with a first cam portion. A second cam portion is formed in the wall of the guide groove of the cam member. The ends of a first arm and a second arm are placed in contact with the first and second cam portions respectively. As the cam member is rotated, the first and second arms move, following the shapes of the first and second cam portions. The motion of the first and second arms is used to operate the recording and reproducing apparatus.

Abstract: A tape loading mechanism of a video tape recorder includes a tape guide carrier for driving first and second groups of tape guides for pulling out withdrawing a tape from a cassette and winding the tape to a tape guide drum having an arcuate shape so as to rotate around the tape guide drum and drive the tape guide groups. The tape guide groups are mounted to end of the tape guide carrier and the carrier is disposed at the intermediate position of height between the first and second tape guide groups held by a positioning mechanism. Accordingly, the rotating plane of the tape guide carrier rotating around the guide drum is positioned between the first and second tape guide groups.

Abstract: A magnetic recording and reproducing apparatus having a single electromagnet for driving an idler mechanism for driving a take-up reel mount in a forward playback operation, a brake mechanism for a supply reel in a forward playback operation and a brake mechanism for the take-up reel mount. A high speed capstan-driven tape transport in both forward and reverse directions is attained by a simple construction.