Patents by Inventor Tatsuya Sunamoto

Tatsuya Sunamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220302581
    Abstract: Provided is an antenna system useful for communication using high-frequency waves. The antenna system (100) comprises a first glass layer (101) that transmits high-frequency waves; a low-dielectric layer (103) having a lower dielectric constant than that of the first glass layer (101), the low-dielectric layer disposed adjacent to the first glass layer (101) and transmitting the high-frequency waves entering through the first glass layer (101); and an antenna circuit board (107) disposed adjacent to the low-dielectric layer (103) and including a high-frequency insulation layer (105) that receives the high-frequency waves entering through the low-dielectric layer (103).
    Type: Application
    Filed: June 2, 2022
    Publication date: September 22, 2022
    Applicant: KURARAY CO., LTD.
    Inventors: Tatsuya Sunamoto, Chikako Miyauchi, Koichiro Isoue
  • Publication number: 20220264226
    Abstract: Provided is an acoustic diaphragm with required properties for a vibrating part and an edge part thereof. The acoustic diaphragm comprises a vibrating part 11 and an edge part 12 located at an outer periphery of the vibrating part, wherein the vibrating part comprises a thermoplastic liquid crystal polymer (TLCP) having a certain composition; the edge part comprises a TLCP having a same composition as the TLCP of the vibrating part; and the vibrating part 11 and the edge part 12 have elastic moduli Ed and Ee measured by nanoindentation technique, respectively, which satisfy the following formula: Ed>Ee. For example, a ratio Ed/Ee of the elastic modulus Ed of the vibrating part 11 to the elastic modulus Ee of the edge part 12 may fall within a range of from 1.05 to 5.0.
    Type: Application
    Filed: May 9, 2022
    Publication date: August 18, 2022
    Applicant: KURARAY CO., LTD.
    Inventors: Tatsuya SUNAMOTO, Xianwen ZHANG
  • Publication number: 20220105689
    Abstract: Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film; examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2): 38<X+Y<65 ??(1) ?8.
    Type: Application
    Filed: June 16, 2021
    Publication date: April 7, 2022
    Applicant: KURARAY CO., LTD.
    Inventors: Takahiro NAKASHIMA, Minoru ONODERA, Tatsuya SUNAMOTO
  • Publication number: 20210289618
    Abstract: Provided are a circuit board including an insulating layer including a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board including an insulating layer (31) and a high voltage circuit layer (34), wherein the insulating layer includes a thermoplastic liquid crystal polymer. It is preferable that the circuit board includes a heat dissipation part (39) for dissipating heat from the insulating layer (31).
    Type: Application
    Filed: June 2, 2021
    Publication date: September 16, 2021
    Applicant: KURARAY CO., LTD.
    Inventors: Tatsuya SUNAMOTO, Minoru ONODERA
  • Publication number: 20210251074
    Abstract: Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 12, 2021
    Applicant: KURARAY CO., LTD.
    Inventors: Minoru ONODERA, Tatsuya SUNAMOTO, Takeshi TAKAHASHI, Takahiro NAKASHIMA
  • Patent number: 11052638
    Abstract: A metal-clad laminate (1) includes a thermoplastic liquid crystal polymer film (2), a metal deposition layer (4) formed on one surface of the thermoplastic liquid crystal polymer film (2), and metal foil (6) laminated to the other surface of the thermoplastic liquid crystal polymer film (2).
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 6, 2021
    Assignee: KURARAY CO., LTD.
    Inventors: Shinji Hiramatsu, Takahiro Nakashima, Tatsuya Sunamoto, Shigeaki Suzuki
  • Publication number: 20210197527
    Abstract: A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C?O>/<COO> of 0.10 or higher in which the <C?O> represents a proportion of a peak area of [C?O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.
    Type: Application
    Filed: May 27, 2019
    Publication date: July 1, 2021
    Inventors: Tatsuya SUNAMOTO, Shinji HIRAMATSU, Minoru ONODERA
  • Publication number: 20200290315
    Abstract: A metal-clad laminate (1) includes a thermoplastic liquid crystal polymer film (2), a metal deposition layer (4) formed on one surface of the thermoplastic liquid crystal polymer film (2), and metal foil (6) laminated to the other surface of the thermoplastic liquid crystal polymer film (2).
    Type: Application
    Filed: March 2, 2017
    Publication date: September 17, 2020
    Applicant: KURRARAY CO., LTD
    Inventors: Shinji HIRAMATSU, Takahito NAKASHIMA, Tatsuya SUNAMOTO, Shigeaki SUZUKI
  • Patent number: 10653001
    Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: May 12, 2020
    Assignee: KURARAY CO., LTD.
    Inventors: Kazuyuki Ohmori, Tatsuya Sunamoto
  • Publication number: 20200017769
    Abstract: Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.
    Type: Application
    Filed: September 20, 2019
    Publication date: January 16, 2020
    Applicant: Kuraray Co., Ltd.
    Inventors: Takafumi KONNO, Tatsuya SUNAMOTO, Michiyuki NANBA, Tetsuya HARA
  • Publication number: 20190174622
    Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
    Type: Application
    Filed: February 7, 2019
    Publication date: June 6, 2019
    Applicant: KURARAY CO., LTD.
    Inventors: Kazuyuki OHMORI, Tatsuya SUNAMOTO
  • Patent number: 10244619
    Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: March 26, 2019
    Assignee: KURARAU CO., LTD.
    Inventors: Kazuyuki Ohmori, Tatsuya Sunamoto
  • Patent number: 9538646
    Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (?r2) of the film after heating to a dielectric constant (?r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |?r2??r1|/?r1×100?5??(I) where ?r1 denotes the relative dielectric constant before the heating, ?r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: January 3, 2017
    Assignee: KURARAY CO., LTD.
    Inventors: Minoru Onodera, Tatsuya Sunamoto, Shuji Matsunaga, Takafumi Konno
  • Patent number: 9439303
    Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: September 6, 2016
    Assignee: KURARAY CO., LTD.
    Inventors: Minoru Onodera, Shuji Matsunaga, Tatsuya Sunamoto, Shigeaki Suzuki
  • Publication number: 20160255715
    Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
    Type: Application
    Filed: April 27, 2016
    Publication date: September 1, 2016
    Applicant: KURARAY CO., LTD.
    Inventors: Kazuyuki OHMORI, Tatsuya SUNAMOTO
  • Publication number: 20160236402
    Abstract: Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film; examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2): 38<X+Y<65 ??(1) ?8.
    Type: Application
    Filed: April 25, 2016
    Publication date: August 18, 2016
    Applicant: Kuraray Co., Ltd.
    Inventors: Takahiro NAKASHIMA, Minoru Onodera, Tatsuya Sunamoto
  • Patent number: 9363890
    Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: June 7, 2016
    Assignee: KURARAY CO., LTD.
    Inventors: Kazuyuki Ohmori, Tatsuya Sunamoto
  • Publication number: 20150195921
    Abstract: Provided is a circuit board being composed of at least a thermoplastic liquid crystal polymer film and an adhesive layer containing a polyphenylene ether-based resin, the circuit board capable of being formed or shaped at a low temperature, and a method of manufacturing the same. The thermoplastic liquid crystal polymer film constitutes at least one circuit board material selected from the group consisting of an insulating substrate, a circuit layer material and a coverlay. The film is laminated to another circuit board material via the adhesive layer. The glass transition temperature of the adhesive layer is in a range from 200° C. to 300° C.
    Type: Application
    Filed: March 19, 2015
    Publication date: July 9, 2015
    Applicant: Kuraray Co., Ltd.
    Inventors: Minoru ONODERA, Shuji Matsunaga, Tatsuya Sunamoto, Shigeaki Suzuki
  • Publication number: 20150017413
    Abstract: A thermoplastic liquid polymer film and a method of producing the same are provided. The method includes preparing a thermoplastic liquid crystal polymer film that has dielectric constants of not larger than 3.25 both in an MD direction and in a TD direction; and performing drawing of the film while heating the film at a temperature in a range from a temperature (Td-60° C.) that is 60° C. lower than a heat deformation temperature (Td) of the film to a temperature (Td-5° C.) that is 5° C. lower than Td. The temperature of the heating during the drawing of the film may be in a range from a temperature (Td-40° C.) that is 40° C. lower than a heat deformation temperature (Td) of the film subjected to the drawing to a temperature (Td-10° C.) that is 10° C. lower than Td.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Applicant: KURARAY CO., LTD
    Inventors: Takafumi KONNO, Tatsuya SUNAMOTO, Minoru ONODERA, Shuji MATSUNAGA, Kazuyuki OHMORI
  • Publication number: 20140231123
    Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (?r2) of the film after heating to a dielectric constant (?r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |?r2??r1|/?r1×100?5??(I) where ?r1 denotes the relative dielectric constant before the heating, ?r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.
    Type: Application
    Filed: April 23, 2014
    Publication date: August 21, 2014
    Applicant: KURARAY CO., LTD.
    Inventors: Minoru ONODERA, Tatsuya SUNAMOTO, Shuji MATSUNAGA, Takafumi KONNO