Abstract: Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

Abstract: Provided is an acoustic diaphragm with required properties for a vibrating part and an edge part thereof. The acoustic diaphragm comprises a vibrating part 11 and an edge part 12 located at an outer periphery of the vibrating part, wherein the vibrating part comprises a thermoplastic liquid crystal polymer (TLCP) having a certain composition; the edge part comprises a TLCP having a same composition as the TLCP of the vibrating part; and the vibrating part 11 and the edge part 12 have elastic moduli Ed and Ee measured by nanoindentation technique, respectively, which satisfy the following formula: Ed>Ee. For example, a ratio Ed/Ee of the elastic modulus Ed of the vibrating part 11 to the elastic modulus Ee of the edge part 12 may fall within a range of from 1.05 to 5.0.

Abstract: Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

Abstract: Provided is an antenna system useful for communication using high-frequency waves. The antenna system (100) comprises a first glass layer (101) that transmits high-frequency waves; a low-dielectric layer (103) having a lower dielectric constant than that of the first glass layer (101), the low-dielectric layer disposed adjacent to the first glass layer (101) and transmitting the high-frequency waves entering through the first glass layer (101); and an antenna circuit board (107) disposed adjacent to the low-dielectric layer (103) and including a high-frequency insulation layer (105) that receives the high-frequency waves entering through the low-dielectric layer (103).

Abstract: Provided is an acoustic diaphragm with required properties for a vibrating part and an edge part thereof. The acoustic diaphragm comprises a vibrating part 11 and an edge part 12 located at an outer periphery of the vibrating part, wherein the vibrating part comprises a thermoplastic liquid crystal polymer (TLCP) having a certain composition; the edge part comprises a TLCP having a same composition as the TLCP of the vibrating part; and the vibrating part 11 and the edge part 12 have elastic moduli Ed and Ee measured by nanoindentation technique, respectively, which satisfy the following formula: Ed>Ee. For example, a ratio Ed/Ee of the elastic modulus Ed of the vibrating part 11 to the elastic modulus Ee of the edge part 12 may fall within a range of from 1.05 to 5.0.

Abstract: Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film; examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2): 38<X+Y<65 ??(1) ?8.

Abstract: Provided are a circuit board including an insulating layer including a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board including an insulating layer (31) and a high voltage circuit layer (34), wherein the insulating layer includes a thermoplastic liquid crystal polymer. It is preferable that the circuit board includes a heat dissipation part (39) for dissipating heat from the insulating layer (31).

Abstract: Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

Abstract: A metal-clad laminate (1) includes a thermoplastic liquid crystal polymer film (2), a metal deposition layer (4) formed on one surface of the thermoplastic liquid crystal polymer film (2), and metal foil (6) laminated to the other surface of the thermoplastic liquid crystal polymer film (2).

Abstract: A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C?O>/<COO> of 0.10 or higher in which the <C?O> represents a proportion of a peak area of [C?O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.

Abstract: A metal-clad laminate (1) includes a thermoplastic liquid crystal polymer film (2), a metal deposition layer (4) formed on one surface of the thermoplastic liquid crystal polymer film (2), and metal foil (6) laminated to the other surface of the thermoplastic liquid crystal polymer film (2).

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (?r2) of the film after heating to a dielectric constant (?r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |?r2??r1|/?r1×100?5??(I) where ?r1 denotes the relative dielectric constant before the heating, ?r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film; examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2): 38<X+Y<65 ??(1) ?8.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.