Patents by Inventor Tatsuya Takaku

Tatsuya Takaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, semiconductor device, and method of manufacturing semiconductor device
    Patent number: 8610253
    Abstract: A lead frame includes a die stage; an inner lead provided near the die stage; and a bus bar provided between the die stage and the inner lead and supported by a hanging lead, wherein the hanging lead is inclined with respect to the inner lead, and a wire connection face of the bus bar is displaced with respect to a wire connection face of the inner lead in a direction of a frame thickness.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 17, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Takahiro Yurino, Hiroshi Aoki, Tatsuya Takaku
  • LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20120074550
    Abstract: A lead frame includes a die stage; an inner lead provided near the die stage; and a bus bar provided between the die stage and the inner lead and supported by a hanging lead, wherein the hanging lead is inclined with respect to the inner lead, and a wire connection face of the bus bar is displaced with respect to a wire connection face of the inner lead in a direction of a frame thickness.
    Type: Application
    Filed: June 27, 2011
    Publication date: March 29, 2012
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Takahiro Yurino, Hiroshi Aoki, Tatsuya Takaku