Abstract: According to the embodiment, an array substrate includes a substrate, a plurality of first wirings, a plurality of second wirings, a thin film transistor, a protective layer, and a plurality of connection parts electrically connected to each of the plurality of first wirings and the plurality of second wirings, and including a conductive material having higher corrosion resistance than a material of the plurality of first wirings and the plurality of second wirings. An end surface of the plurality of first wirings and the plurality of second wirings on peripheral side of the substrate is covered with the protective layer, and an end surface of the connection part on the peripheral side of the substrate is located at a periphery of the substrate in plan view.