Abstract: A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

Abstract: An object is to provide a communication system, a communication apparatus, and a terminal apparatus capable of integrating communication paths of both of mobile access and fixed access while addition of a new function to a mobile network is reduced. In a communication system 100 according to the present invention, a communication path of one mobile bearer between a base station master station apparatus 300 and a user gateway 600 includes a split bearer configuration including a mobile access communication path being connected from the base station master station apparatus 300 to the user gateway 600 via a mobile access slave station apparatus 400 and a non-mobile access communication path being connected from the base station master station apparatus 300 to the user gateway 600 via a non-mobile access slave station apparatus 500.

Abstract: To provide a reinforced glass container which has impact resistance and which can be used for treatment involving exposure to high temperatures or ultraviolet irradiation. The reinforced glass container of the present invention comprises a glass container and a polymer layer provided on the outer surface of the glass container and having a thickness of more than 1 ?m, wherein the polymer layer contains a tetrafluoroethylene type polymer having a melting temperature of more than 260° C. and having carbonyl group-containing groups or hydroxy group-containing groups.

Abstract: To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.

Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.

Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film. The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

Abstract: To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 ?m, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.

Abstract: To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.

Abstract: To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength. A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.

Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.

Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.

Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.

Abstract: To provide a method for producing a liquid composition, whereby agglomeration of the resin powder is suppressed even at a low viscosity and it is possible to obtain a uniformly dispersed liquid composition, and a method for producing a film, etc. by using the method for producing a liquid composition. The method for producing a liquid composition comprises heat-treating a mixture comprising a resin powder having an average particle size of from 0.02 to 200 ?m made from a powder material containing a fluorinated polymer having a specific functional group, a binder component having a reactive group reactive with the functional group of the resin powder, and a liquid medium capable of dissolving the binder component, to obtain a liquid composition, of which the viscosity change rate to the viscosity before heating is from 5 to 200%. Further, the method for producing a film, etc. uses the liquid composition obtained by the method for producing a liquid composition.

Abstract: To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 ?m, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.

Abstract: To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength. A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.

Abstract: A fluorinated resin composition includes a copolymer (A); and a copolymer (B). A mass ratio (A/B) of the copolymer (A) to the copolymer (B) is from 60/40 to 99/1, and a volume flow rate is from 0.5 to 100 mm3/sec. The copolymer (A) comprises: units derived from a monomer (a) which is tetrafluoroethylene; units derived from a monomer (b) which is at least one member selected from ethylene, hexafluoropropylene and a perfluoro(alkyl vinyl ether). The copolymer (A) has carbonyl groups. The copolymer (B) comprises: units derived from the monomer (a); units derived from the monomer (b); and units derived from the monomer (c) having two or more polymerizable carbon-carbon double bonds. A content of the units derived from the monomer (c) is from 0.1 to 2 mol % based on total units in the copolymer (B).

Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, a layer (A) 10 which is made of a fluororesin material containing a melt-moldable fluororesin (a) having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant of from 2.0 to 3.