Abstract: Movement information is calculated with high accuracy, without being influenced by the number of GNSS signals receivable by each of a plurality of antennas. A movement information calculating device includes a plurality of antennas, a clock generator, a plurality of GNSS receivers, and an arithmetic logical unit. The plurality of antennas, each receives a GNSS signal. The clock generator generates a clock signal. The plurality of GNSS receivers are connected to the respective antennas, and share the clock signal from the clock generator and calculate GNSS observed values by using the shared clock signal and the GNSS signals, respectively. The arithmetic logical unit calculates movement information including a speed of a movable body based on the GNSS observed values from the plurality of GNSS receivers.

Abstract: A molding drum is provided in which a sheet-shaped rubber member for a tire is wound around an outer circumferential surface having a cylindrical shape. A plurality of segments are arranged in a drum circumferential direction, and the outer circumferential surface of the molding drum is formed by outer surfaces of the segments coinciding with each other. At least one of the plurality of segments is a tip-end holding segment including at least a first small segment and a second small segment that serve as small segments arranged in the drum circumferential direction. The first small segment can take a first state in which an outer surface of the first small segment coincides with an outer surface of the second small segment, and a second state in which at least a portion of the first small segment is disposed outward of the second small segment in a drum radial direction.

Abstract: A semiconductor device including: a first gate electrode; a first gate insulating layer on the first gate electrode; a first oxide semiconductor layer on the first insulating layer; source and drain electrodes connected to the first oxide semiconductor layer; a second gate insulating layer on the first oxide semiconductor layer; a second oxide semiconductor layer on the second gate insulating layer; a second gate electrode on the second oxide semiconductor layer, the second gate electrode being in contact with the second oxide semiconductor layer; a first insulating layer on the second gate electrode, the first insulating layer having a part of a first aperture overlapping with the second oxide semiconductor layer in a planar view; and a first connecting electrode electrically connecting the first gate electrode and the second gate electrode via the first aperture.

Abstract: A display device comprising a transistor and a display element over the transistor, wherein the transistor includes a gate electrode on an insulating surface, a gate insulating layer on the gate electrode, and source/drain electrodes on the oxide semiconductor layer and the gate insulating layer, each including a first conductive layer containing nitrogen and a second conductive layer on the first conductive layer, and an insulating layer contains oxygen on the oxide semiconductor layer and the source/drain electrodes.

Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

Abstract: A cutting tool (1) formed of a silicon nitride-based sintered body (2) including a matrix phase (3), a hard phase (4), and a grain boundary phase (10) in which a glass phase (11) and a crystal phase (12) exist. The sintered body (2) contains yttrium in an amount of 5.0 wt % to 15.0 wt % in terms of an oxide, and contains titanium nitride as the hard phase (4) in an amount of 5.0 wt % to 25.0 wt %. In an X-ray diffraction peak, a halo pattern appears at 2? ranging from 25° to 35° in an internal region of the sintered body (2). A ratio B/A of a maximum peak intensity B to a maximum peak intensity A satisfies 0.11?B/A?0.40 . . . Expression (1) in a surface region of the sintered body (2), and satisfies 0.00?B/A?0.10 . . . Expression (2) in the internal region of the sintered body (2).

Abstract: A semiconductor device comprising: an oxide semiconductor layer including indium; a gate electrode facing to the oxide semiconductor layer; a gate insulating layer between the oxide semiconductor layer and the gate electrode; a first conductive layer arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer; an oxide portion formed on the oxide semiconductor layer and at an edge of the first conductive layer, the oxide portion being a oxide of the first conductive layer.

Abstract: A semiconductor device includes an oxide semiconductor layer including indium, a gate electrode facing the oxide semiconductor layer, a gate insulating layer between the oxide semiconductor layer and the gate electrode, and a first electrode arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer. The indium is unevenly distributed in an unevenly distributed region among the oxide semiconductor layer. The unevenly distributed region overlaps with the first conductive layer in a planar view.

Abstract: A display device comprising a transistor and a display element over the transistor, wherein the transistor includes a gate electrode on an insulating surface, a gate insulating layer on the gate electrode, and source/drain electrodes on the oxide semiconductor layer and the gate insulating layer, each including a first conductive layer containing nitrogen and a second conductive layer on the first conductive layer, and an insulating layer contains oxygen on the oxide semiconductor layer and the source/drain electrodes.

Abstract: To reduce degradation of characteristics and reliability of a transistor including an oxide semiconductor as an active layer. A thin film transistor comprising: an active layer formed of an oxide semiconductor including at least indium and gallium; an electrode layer including an aluminum layer and partially formed on the active layer; and an interlayer insulating layer formed on the active layer, wherein a peak value of chlorine concentration at an interface between the interlayer insulating layer and the active layer is equal to or less than 2.0×1019 [atoms/cm3], and a peak value of aluminum concentration at an interface between the interlayer insulating layer and the active layer is equal to or less than 1.0×1020 [atoms/cm3].

Abstract: To sufficiently reduce an off-leakage current of a transistor including an oxide semiconductor as an active layer, provide a transistor having uniform characteristics when forming a large number of transistors on a large substrate, and reduce a load on a manufacturing process. A thin film transistor comprising: an active layer formed of an oxide semiconductor including at least indium and gallium; a gate electrode; a first gate insulating layer disposed between the active layer and the gate electrode on the gate electrode side; and a second gate insulating layer, which is a hydrogen block layer, disposed between the active layer and the gate electrode on the active layer side.

Abstract: A thin film transistor comprising an active layer made of an oxide semiconductor containing indium and gallium, an electrode layer including a titanium layer formed on the active layer, wherein an indium concentration is equal to or less than 1.3 times an oxygen concentration in a range of 15 nm from an interface between the active layer and the electrode layer toward the active layer.

Abstract: A semiconductor device comprising: an oxide semiconductor layer including indium; a gate electrode facing to the oxide semiconductor layer; a gate insulating layer between the oxide semiconductor layer and the gate electrode; a first conductive layer arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer; an oxide portion formed on the oxide semiconductor layer and at an edge of the first conductive layer, the oxide portion being a oxide of the first conductive layer.

Abstract: The purpose of the present invention is to avoid an inflection point in Vg-Id characteristics of the Thin Film transistor, and to avoid step disconnection of the insulating film formed on the semiconductor layer in the display device. The concrete structure of the present invention is: a display device including a TFT substrate having a thin film transistor (TFT) comprising; the TFT having a channel width and a channel length, a gate insulating film formed on a gate electrode, a semiconductor layer formed on the gate insulating film, wherein the gate electrode, near its edge, has a first sloping surface having a first taper angle in a cross sectional view along the direction of the channel width, an edge of the semiconductor layer in the cross sectional view along the direction of the channel width lies on the first sloping surface of the gate electrode.

Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

Abstract: A semiconductor device including: a first gate electrode; a first gate insulating layer on the first gate electrode; a first oxide semiconductor layer on the first insulating layer; source and drain electrodes connected to the first oxide semiconductor layer; a second gate insulating layer on the first oxide semiconductor layer; a second oxide semiconductor layer on the second gate insulating layer; a second gate electrode on the second oxide semiconductor layer, the second gate electrode being in contact with the second oxide semiconductor layer; a first insulating layer on the second gate electrode, the first insulating layer having a part of a first aperture overlapping with the second oxide semiconductor layer in a planar view; and a first connecting electrode electrically connecting the first gate electrode and the second gate electrode via the first aperture.

Abstract: The purpose of the present invention is to avoid an inflection point in Vg-Id characteristics of the Thin Film transistor, and to avoid step disconnection of the insulating film formed on the semiconductor layer in the display device. The concrete structure of the present invention is: a display device including a TFT substrate having a thin film transistor (TFT) comprising; the TFT having a channel width and a channel length, a gate insulating film formed on a gate electrode, a semiconductor layer formed on the gate insulating film, wherein the gate electrode, near its edge, has a first sloping surface having a first taper angle in a cross sectional view along the direction of the channel width, an edge of the semiconductor layer in the cross sectional view along the direction of the channel width lies on the first sloping surface of the gate electrode.