Patents by Inventor Tatsuya Tsugawa

Tatsuya Tsugawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7828892
    Abstract: The object of the present invention is to provide an inorganic board whose dimensional stability, anti-freezing and fusing properties, and the like are much improved. To attain this object, an inorganic board is manufactured using a method comprising: preparing a raw material slurry by the dispersing of a cementitious material, silica-containing material, woody reinforcement, and mica in water, forming a papered mat by sheet forming the raw material slurry, pressing the papered mat, and curing the pressed papered mat in an autoclave at a temperature higher than 150° C., wherein the mass ratio of the cementitious inorganic material and silica-containing material is set to be in the range of between 35:65 and 45:55, to promote the curing reaction of the inorganic board and improve its dimensional stability and anti-freezing and fusing properties.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: November 9, 2010
    Assignee: Nichiha Corporation
    Inventors: Kazuo Utagaki, Tatsuya Tsugawa, Yoshitaka Doi
  • Publication number: 20070245930
    Abstract: The object of the present invention is to provide an inorganic board whose dimensional stability, anti-freezing and fusing properties, and the like are much improved. To attain this object, an inorganic board is manufactured using a method comprising: preparing a raw material slurry by the dispersing of a cementitious material, silica-containing material, woody reinforcement, and mica in water, forming a papered mat by sheet forming the raw material slurry, pressing the papered mat, and curing the pressed papered mat in an autoclave at a temperature higher than 150° C., wherein the mass ratio of the cementitious inorganic material and silica-containing material is set to be in the range of between 35:65 and 45:55, to promote the curing reaction of the inorganic board and improve its dimensional stability and anti-freezing and fusing properties.
    Type: Application
    Filed: August 29, 2005
    Publication date: October 25, 2007
    Applicant: NICHIHA CORPORATION
    Inventors: Kazuo Utagaki, Tatsuya Tsugawa, Yoshitaka Doi