Abstract: A recording medium production device includes a substrate positioning pin vertically movable that performs positioning to a center-hole of a substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold the substrate; a cleaner having a gas ejection portion that ejects gas toward the surface of the substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward. The fixing portion is configured so as not to contact an inner circumferential side surface of the center-hole of substrate. The substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate, and presses and fixes the substrate positioning pin. Then the cleaner performs ejection and suction of gas.

Abstract: A recording medium production device includes a substrate positioning pin vertically movable that performs positioning to a center-hole of a substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold the substrate; a cleaner having a gas ejection portion that ejects gas toward the surface of the substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward. The fixing portion is configured so as not to contact an inner circumferential side surface of the center-hole of substrate. The substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate, and presses and fixes the substrate positioning pin. Then the cleaner performs ejection and suction of gas.

Abstract: A recording medium production device includes a substrate positioning pin vertically movable that performs positioning to a center-hole of a substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold the substrate; a cleaner having a gas ejection portion that ejects gas toward the surface of the substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward. The fixing portion is configured so as not to contact an inner circumferential side surface of the center-hole of substrate. The substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate, and presses and fixes the substrate positioning pin. Then the cleaner performs ejection and suction of gas.

Abstract: An optical recording medium production device of the invention include: a rotary table on which a substrate of an optical recording medium is placed; and dropping unit for dropping resin for forming a light transmissive film layer during rotation of the rotary table, wherein the dropping unit drops the resin onto an inside of the substrate and a side surface of the substrate. By applying the production device of the invention, in the spin coat method, a UV curable resin layer can be formed a cross-sectional shape of which is uniform in a whole circumference of the optical recording medium side surface.

Abstract: The recording medium production device, comprising: a substrate positioning pin vertically movable that performs positioning to a center-hole of substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold substrate; a cleaner having a gas ejection portion that ejects gas toward surface of substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward, configured so as not to contact with an inner circumferential side surface of the center-hole of substrate; wherein the substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate holding portion to form gap near the inner circumferential side surface of the center-hole of substrate, and presses and fixes the substrate positioning pin, and then the cleaner performs ejection and suction of gas.