Patents by Inventor Tatsuzi Nakagawa

Tatsuzi Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5560939
    Abstract: A mold assembly having at least one mold body with at least one cavity formed therein. The mold includes at least one mold insert coupling portion formed on the mold body; at least one mold insert being of substantially complementary size and shape with respect to the mold insert coupling portion, each insert being provided with a tapered guide surface for guiding the mold insert into the mold insert coupling portion; at least one means for clamping the mold insert in a predetermined position within the mold insert coupling portion. The mold insert is reciprocally movable within the mold insert coupling portion in a direction generally perpendicular to the parting line of the mold assembly.
    Type: Grant
    Filed: March 13, 1991
    Date of Patent: October 1, 1996
    Assignees: Aida Engineering, Ltd., Hoya Corporation
    Inventors: Tatsuzi Nakagawa, Tatsuo Nishimoto
  • Patent number: 4902220
    Abstract: A vertical injection molding machine having an upper die (26) and a lower die (27) which are adapted to be brought together in the vertical direction by the force produced by a die closing device. The injection molding machine has an injection unit 1 disposed below the lower die (27) and is hinged through a hinge shaft (36) to a truck (35) movable along rails (37), such that the injection unit 1 is swingable vertically about the axis of the hinge shaft (36). The vertical swinging motion of the injection unit 1 is effected by cylinders (38) connected to an injection head (2) of the injection unit (1). A compression forming cylinder device (70) is provided on the lower end of each of a plurality of tie-bars which are connected between the upper die (26) and the lower die (27).
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: February 20, 1990
    Assignee: Aida Engineering, Ltd.
    Inventor: Tatsuzi Nakagawa