Abstract: An inspection apparatus is provided capable of adequately positioning an inspection chip to a conductive pattern as an inspection object. For connecting an electrode pad 1b of an inspection chip 1 with a lead 2a of a package 2, bump electrodes 3 and 4 are first provided at the inspection chip and at the package, respectively. Then, an anisotropic conductor 5 is provided to cover between the bump electrodes 3 and 4, and a conductor film 6 is provided on the anisotropic conductor 5 to extend between the bump electrodes 3 and 4. The anisotropic conductor 5 is thermo-compression bonded to provide an electrical connection between the conductor film 6 and the bump electrodes 3 and 4. This structure may provide a desirable surface of the inspection chip 1 having a sufficiently reduced thickness.

Abstract: The present invention provides an inspection apparatus and inspection method capable of inspecting the shape of a board used in a liquid crystal panel with high fineness and efficiency. A computer 21 controls an X-electrode select section 22 and a Y-electrode select section 23 to drive liquid crystal driving electrodes 102 selectively. A FLASHSHOCK Sensor 1 is located at a position opposed to a board 100 in a non-contact manner. The FLASHSHOCK Sensor 1 is adapted to detect each potential variation caused in the liquid crystal electrodes 101-104 and then output the detected potential variation to the computer 21 as a detect signal. The computer 21 receives the detect signal from the FLASHSHOCK Sensor 1 to create image data, and detects disconnection, short-circuit, chipping or the like in the liquid crystal electrodes based on the created image data. Further, the computer 21 displays an image representing each shape of the liquid crystal electrodes on a display 21a.

Abstract: It is an object of the present invention to finely inspect a dimension of a conductive pattern. A sensor element 12a includes an MOSFET. A diffusion layer of the MOSFET having a larger surface area serves as a passive element, and is placed opposes to the conductive pattern. The passive element is formed continuously with a source of the MOSFET to be electrically conductive thereto. A gate of the MOSFET is connected to a vertical select section 14, and a drain of the MOSFET is connected to a lateral select section 13. When a sensor element 12a is selected by a timing generating section 15, a signal is transmitted from the vertical select section 14 to the gate to turn on the MOSFET. In this moment, if an inspection signal is output from a probe 22, the potential in the conductive pattern 101 is varied. Thus, a current flows from the source to the drain and then the current is transmitted to a signal processing section 16 through the lateral select section 13.

Abstract: The present invention provides an inspection apparatus and method capable of intuitively obtaining inspection results of circuit wirings. An inspection system 20 comprises a sensor chip 1 including plural sensor elements, a computer 21, probes 22 for supplying an inspection signal to circuit wirings 101, and a selector 23 for switching the supply of the inspection signal to the probes 22. The computer 21 receives the detected signals from the sensor chip 1, and generates an image data to display an image of the circuit wirings as an inspection subject on a display 21a. This make it possible to check the shape of the specific circuit wiring and to detect defects such as disconnection, short-circuit, and chipping in the circuit wiring 101 based on the generated image data and the design image data representing the design circuit wiring.

Abstract: The present invention provides an inspection apparatus and inspection method capable of inspecting the shape of a board used in a liquid crystal panel with high fineness and efficiency. A computer 21 controls an X-electrode select section 22 and a Y-electrode select section 23 to drive liquid crystal driving electrodes 102 selectively. A FLASHSHOCK Sensor 1 is located at a position opposed to a board 100 in a non-contact manner. The FLASHSHOCK Sensor 1 is adapted to detect each potential variation caused in the liquid crystal electrodes 101-104 and then output the detected potential variation to the computer 21 as a detect signal. The computer 21 receives the detect signal from the FLASHSHOCK Sensor 1 to create image data, and detects disconnection, short-circuit, chipping or the like in the liquid crystal electrodes based on the created image data. Further, the computer 21 displays an image representing each shape of the liquid crystal electrodes on a display 21a.

Abstract: It is an object of the present invention to finely inspect a dimension of a conductive pattern.

Abstract: The present invention provides an inspection apparatus capable of adequately positioning an inspection chip to a conductive pattern as an inspection object.

Abstract: The present invention provides an inspection apparatus and method capable of intuitively obtaining inspection results of circuit wirings. An inspection system 20 comprises a sensor chip 1 including plural sensor elements, a computer 21, probes 22 for supplying an inspection signal to circuit wirings 101, and a selector 23 for switching the supply of the inspection signal to the probes 22. The computer 21 receives the detected signals from the sensor chip 1, and generates an image data to display an image of the circuit wirings as an inspection subject on a display 21a. This make it possible to check the shape of the specific circuit wiring and to detect defects such as disconnection, short-circuit, and chipping in the circuit wiring 101 based on the generated image data and the design image data representing the design circuit wiring.