Patents by Inventor Tatunori YANAGIMOTO

Tatunori YANAGIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding
    Patent number: 10522482
    Abstract: An object of the present invention is to obtain a semiconductor device having highly reliable bonding portions. The semiconductor device according to the present invention includes an insulating substrate on which a conductive pattern is formed, and an electrode terminal and a semiconductor element which are bonded to the conductive pattern, the electrode terminal and the conductive pattern are bonded by ultrasonic bonding on a bonding face, and the ultrasonic bonding is performed at a plurality of positions.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 31, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yumie Kitajima, Tatunori Yanagimoto, Kiyoshi Arai
  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20190139906
    Abstract: An object of the present invention is to obtain a semiconductor device having highly reliable bonding portions. The semiconductor device according to the present invention includes an insulating substrate on which a conductive pattern is formed, and an electrode terminal and a semiconductor element which are bonded to the conductive pattern, the electrode terminal and the conductive pattern are bonded by ultrasonic bonding on a bonding face, and the ultrasonic bonding is performed at a plurality of positions.
    Type: Application
    Filed: December 31, 2018
    Publication date: May 9, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yumie KITAJIMA, Tatunori YANAGIMOTO, Kiyoshi ARAI
  • SEMICONDUCTOR DEVICE
    Publication number: 20170207179
    Abstract: An object of the present invention is to obtain a semiconductor device having highly reliable bonding portions. The semiconductor device according to the present invention includes an insulating substrate on which a conductive pattern is formed, and an electrode terminal and a semiconductor element which are bonded to the conductive pattern, the electrode terminal and the conductive pattern are bonded by ultrasonic bonding on a bonding face, and the ultrasonic bonding is performed at a plurality of positions.
    Type: Application
    Filed: August 28, 2014
    Publication date: July 20, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yumie KITAJIMA, Tatunori YANAGIMOTO, Kiyoshi ARAI