Patents by Inventor TATUO YONEMOTO

TATUO YONEMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Prepreg, metal-clad laminated board, and printed wiring board
    Patent number: 9944766
    Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: April 17, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masaaki Matsumoto, Takatoshi Mito, Tatuo Yonemoto
  • PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
    Publication number: 20170218150
    Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.
    Type: Application
    Filed: August 21, 2015
    Publication date: August 3, 2017
    Inventors: MASAAKI MATSUMOTO, TAKATOSHI MITO, TATUO YONEMOTO