Patents by Inventor Tatyana T. Adryushchenko

Tatyana T. Adryushchenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Debond interconnect structures
    Patent number: 9269686
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: February 23, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana T. Adryushchenko, Guanghai Xu