Patents by Inventor Tatyana Tanya Andryushchenko

Tatyana Tanya Andryushchenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Debond interconnect structures
    Patent number: 8637778
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: January 28, 2014
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu
  • DEBOND INTERCONNECT STRUCTURES
    Publication number: 20110247872
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 13, 2011
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana Tanya Andryushchenko, Guanghai Xu