Patents by Inventor Tau-Jing Yang
Tau-Jing Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10958093Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.Type: GrantFiled: March 18, 2020Date of Patent: March 23, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tau-Jing Yang, Kuo-Feng Huang, Chih Lung Hung
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Publication number: 20200220372Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.Type: ApplicationFiled: March 18, 2020Publication date: July 9, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Chih Lung HUNG
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Patent number: 10622836Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.Type: GrantFiled: May 2, 2017Date of Patent: April 14, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tau-Jing Yang, Kuo-Feng Huang, Chih Lung Hung
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Publication number: 20180323629Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.Type: ApplicationFiled: May 2, 2017Publication date: November 8, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Chih Lung HUNG
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Patent number: 9553072Abstract: A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.Type: GrantFiled: August 4, 2016Date of Patent: January 24, 2017Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tau-Jing Yang, Kuo-Feng Huang, Wei Yu Nien
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Publication number: 20160343672Abstract: A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.Type: ApplicationFiled: August 4, 2016Publication date: November 24, 2016Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Wei Yu NIEN
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Publication number: 20160284665Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.Type: ApplicationFiled: March 23, 2015Publication date: September 29, 2016Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Wei Yu NIEN
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Patent number: 9437576Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.Type: GrantFiled: March 23, 2015Date of Patent: September 6, 2016Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tau-Jing Yang, Kuo-Feng Huang, Wei Yu Nien