Abstract: A method for electrically coupling a bond pad of an integrated circuit such as a field programmable device, an application-specific integrated circuit, or a rapid chip with an input/output device is disclosed. The bond pad is provided with a plurality of metal layers configurable for making a connection with the input/output device. The bond pad is then coupled to the input/output device with an interconnect structure. The method for electrically coupling the bond pad to the input/output device allows the customer to configure the power and ground pad counts after the slice is created.

Abstract: A computer-implemented method for creating slotted metal structures in a semiconductor design is disclosed. Aspects of the present invention include providing a library of different types of pre-slotted building block elements. Thereafter, during chip design, a plurality of the elements are selected from the library and placed in the design in abutment to form a composite slotted metal structure.