Abstract: A process for making a ball grid array semiconductor package comprises the steps of: providing a substrate, dispensing adhesive, attaching dice(s) on the substrate, wire bonding, and implanting solder balls. The adhesive with a predetermined viscosity is coated on the adhesive area of the substrate by dispensing or potting to form a specific pattern for die-attaching. The adhesive is easily controlled to avoid covering the bonding pads on the active surface of the die, so that the yield of the semiconductor package is improved without increasing the extra cost. Also, the reliability of the semiconductor package is increased and the manufacturing cost is reduced.

Abstract: A semiconductor package without outer leads such as QFN, SON is disclosed. The semiconductor package includes a die, a molding compound sealing the die, a plurality of metal leads, a plurality of metal bonding wires electrically connecting the die with the metal leads, and a plurality of metal support boards surrounded by the metal leads. The metal support boards support the die together by adhering and are used for being the power connecting terminals or ground potentials. Thus, the semiconductor package has a smaller thermal stress between the die and the metal support boards to avoid a warpage of the package or a delamination and a less noise interference.