Patents by Inventor Tawfik M. Rahal-Arabi
Tawfik M. Rahal-Arabi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11301011Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: GrantFiled: November 26, 2019Date of Patent: April 12, 2022Assignee: INTEL CORPORATIONInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric DiStefano, James G. Hermerding, II
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Patent number: 11188132Abstract: Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.Type: GrantFiled: May 31, 2016Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Yu Liang Shiao, Tawfik M. Rahal-Arabi, Chang-Wu Yen, Celia H. Yang
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Patent number: 10856102Abstract: Embodiments are generally directed to sharing of environmental data for client device usage. An embodiment of a client device includes a processor; an environmental sensor to sense an environmental condition, an output of the sensor being a local environmental sensor value; and a wireless receiver to receive environmental data for a certain proximity area from a second client device according to an environmental data sharing protocol via a wireless network. The environmental data sharing protocol allows receipt of the environmental data without requiring pairing, bonding, or other relationship of client devices.Type: GrantFiled: June 20, 2019Date of Patent: December 1, 2020Assignee: Intel CorporationInventors: Vasudevan Srinivasan, Barnes Cooper, Tawfik M Rahal-Arabi
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Publication number: 20200218319Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: ApplicationFiled: November 26, 2019Publication date: July 9, 2020Applicant: INTEL CORPORATIONInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric DiStefano, James G. Hermerding, II
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Patent number: 10628367Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.Type: GrantFiled: December 28, 2016Date of Patent: April 21, 2020Assignee: INTEL CORPORATIONInventors: Tawfik M. Rahal-Arabi, Prashant Sethi, Anthony M. Constantine, Yu-Liang Shiao, Chang-Wu Yen
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Patent number: 10488899Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: GrantFiled: July 12, 2017Date of Patent: November 26, 2019Assignee: Intel CorporationInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
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Publication number: 20190306654Abstract: Embodiments are generally directed to sharing of environmental data for client device usage. An embodiment of a client device includes a processor; an environmental sensor to sense an environmental condition, an output of the sensor being a local environmental sensor value; and a wireless receiver to receive environmental data for a certain proximity area from a second client device according to an environmental data sharing protocol via a wireless network. The environmental data sharing protocol allows receipt of the environmental data without requiring pairing, bonding, or other relationship of client devices.Type: ApplicationFiled: June 20, 2019Publication date: October 3, 2019Inventors: Vasudevan Srinivasan, Barnes Cooper, Tawfik M Rahal-Arabi
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Patent number: 10397733Abstract: Embodiments are generally directed to sharing of environmental data for client device usage. An embodiment of a client device includes a processor; an environmental sensor to sense an environmental condition, an output of the sensor being a local environmental sensor value; and a wireless receiver to receive environmental data for a certain proximity area from a second client device according to an environmental data sharing protocol via a wireless network. The environmental data sharing protocol allows receipt of the environmental data without requiring pairing, bonding, or other relationship of client devices.Type: GrantFiled: October 1, 2016Date of Patent: August 27, 2019Assignee: INTEL CORPORATIONInventors: Vasudevan Srinivasan, Barnes Cooper, Tawfik M Rahal-Arabi
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Patent number: 10133331Abstract: Various embodiments are generally directed to operation of a computing device powered with first and second sets of energy storage cells, the cells of the first set structurally optimized for higher density storage of electric power, and the cells of the second set structurally optimized for providing electric power at a high electric current level. A battery module includes a casing, a first cell disposed within the casing to store electric energy with a high density, and a second cell disposed within the casing to provide electric energy stored therein with a high current level. Other embodiments are described and claimed herein.Type: GrantFiled: October 22, 2015Date of Patent: November 20, 2018Assignee: INTEL CORPORATIONInventors: Tawfik M. Rahal-Arabi, Alexander B. Uan-Zo-Li, Mark MacDonald, Vivek M. Paranjape, Andy Keates, Don J. Nguyen
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Publication number: 20180181527Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.Type: ApplicationFiled: December 28, 2016Publication date: June 28, 2018Applicant: INTEL CORPORATIONInventors: TAWFIK M. RAHAL-ARABI, PRASHANT SETHI, ANTHONY M. CONSTANTINE, YU-LIANG SHIAO, CHANG-WU YEN
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Publication number: 20180157298Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: ApplicationFiled: July 12, 2017Publication date: June 7, 2018Applicant: Intel CorporationInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
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Publication number: 20180098191Abstract: Embodiments are generally directed to sharing of environmental data for client device usage. An embodiment of a client device includes a processor; an environmental sensor to sense an environmental condition, an output of the sensor being a local environmental sensor value; and a wireless receiver to receive environmental data for a certain proximity area from a second client device according to an environmental data sharing protocol via a wireless network. The environmental data sharing protocol allows receipt of the environmental data without requiring pairing, bonding, or other relationship of client devices.Type: ApplicationFiled: October 1, 2016Publication date: April 5, 2018Inventors: Vasudevan Srinivasan, Barnes COOPER, Tawfik M. RAHAL-ARABI
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Patent number: 9898067Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.Type: GrantFiled: April 1, 2016Date of Patent: February 20, 2018Assignee: INTEL CORPORATIONInventors: Eric Distefano, Guy M. Therien, Vasudevan Srinivasan, Tawfik M. Rahal-Arabi, Venkatesh Ramani, Ryan D. Wells, Stephen H. Gunther, Jeremy J. Shrall, James G. Hermerding, II
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Publication number: 20170368437Abstract: Systems and methods for providing a slalom racing gate monitor system are provided herein. A system includes a microcontroller; a first, second, and third sensor, each coupled to the microcontroller, the first, second, and third sensors each having a field of view and disposed on a slalom pole, and disposed where the fields of view of the first, second, and third sensors substantially cover a 360 degree field of view around the slalom pole; wherein the microcontroller is to: obtain a sequence of sensor readings from a plurality of sensors of the first, second, and third sensors, each reading in the sequence of sensor readings indicating an object detected in the field of view of the respective sensor; determine whether the object passed the slalom pole on a correct side; and present a notification of whether the object passed the slalom pole on the correct side.Type: ApplicationFiled: June 24, 2016Publication date: December 28, 2017Inventors: Tawfik M. Rahal-Arabi, Hong W. Wong
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Patent number: 9849363Abstract: Systems and methods for providing a slalom racing gate monitor system are provided herein. A system includes a microcontroller; a first, second, and third sensor, each coupled to the microcontroller, the first, second, and third sensors each having a field of view and disposed on a slalom pole, and disposed where the fields of view of the first, second, and third sensors substantially cover a 360 degree field of view around the slalom pole; wherein the microcontroller is to: obtain a sequence of sensor readings from a plurality of sensors of the first, second, and third sensors, each reading in the sequence of sensor readings indicating an object detected in the field of view of the respective sensor; determine whether the object passed the slalom pole on a correct side; and present a notification of whether the object passed the slalom pole on the correct side.Type: GrantFiled: June 24, 2016Date of Patent: December 26, 2017Assignee: Intel CorporationInventors: Tawfik M. Rahal-Arabi, Hong W. Wong
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Publication number: 20170344086Abstract: Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.Type: ApplicationFiled: May 31, 2016Publication date: November 30, 2017Inventors: JIMMY Y. HSIAO, TAWFIK M. RAHAL-ARABI, CHANG-WU YEN, CELIA H. YANG
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Patent number: 9710030Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: GrantFiled: December 15, 2014Date of Patent: July 18, 2017Assignee: INTEL CORPORATIONInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
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Patent number: 9564804Abstract: An electronic device may include a plurality of voltage rails to provide voltages to components of a load, a plurality of voltage regulators, and a buck converter apparatus to separately couple to more than one of the plurality of voltage rails and to provide a voltage to at least a specific one of the voltage rails.Type: GrantFiled: June 28, 2013Date of Patent: February 7, 2017Assignee: Intel CorporationInventors: Alexander B Uan-Zo-Li, Jorege P Rodriguez, Sofia C Hao, David W Browning, Jeffrey A Carlson, Tawfik M Rahal-Arabi, Jeffrey L Krieger
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Patent number: 9465418Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.Type: GrantFiled: December 15, 2014Date of Patent: October 11, 2016Assignee: INTEL CORPORATIONInventors: Ketan R. Shah, Tawfik M. Rahal-Arabi, Eric Distefano, James G. Hermerding, II
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Publication number: 20160216754Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.Type: ApplicationFiled: April 1, 2016Publication date: July 28, 2016Inventors: ERIC DISTEFANO, GUY M. THERIEN, VASUDEVAN SRINIVASAN, TAWFIK M. RAHAL-ARABI, VENKATESH RAMANI, RYAN D. WELLS, STEPHEN H. GUNTHER, JEREMY J. SHRALL, JAMES G. HERMERDING, II