Patents by Inventor Tayfun Ilercil

Tayfun Ilercil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8677767
    Abstract: This invention relates to providing energy efficient thermo-electric heat pump systems for iso-thermal transport and storage, of perishable goods, such as vaccines, chemicals, biologicals, and other temperature sensitive goods. Also this invention relates to providing energy efficient iso-thermal transport and storage systems, of perishable goods, which are compact, light weight. This invention further relates to providing on-board energy storage for sustaining, for multiple days, the ability of such iso-thermal transport and storage systems to maintain temperature sensitive goods at a constant-temperature.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: March 25, 2014
    Inventors: Tayfun Ilercil, Alp Ilercil
  • Patent number: 8646282
    Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: February 11, 2014
    Inventors: Alp Ilercil, Tayfun Ilercil
  • Publication number: 20120125014
    Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
    Type: Application
    Filed: January 28, 2010
    Publication date: May 24, 2012
    Inventors: Alp Ilercil, Tayfun Ilercil
  • Publication number: 20100146991
    Abstract: This invention relates to providing energy efficient thermoelectric heat pump systems for iso-thermal transport and storage, of perishable goods, such as vaccines, chemicals, biologicals, and other temperature sensitive goods. Also this invention relates to providing energy efficient iso-thermal transport and storage systems, of perishable goods, which are compact, light weight. This invention further relates to providing on-board energy storage for sustaining, for multiple days, the ability of such iso-thermal transport and storage systems to maintain temperature sensitive goods at a constant-temperature.
    Type: Application
    Filed: January 28, 2009
    Publication date: June 17, 2010
    Inventors: Tayfun Ilercil, Alp Ilercil
  • Patent number: 5861076
    Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.
    Type: Grant
    Filed: September 6, 1995
    Date of Patent: January 19, 1999
    Assignee: Park Electrochemical Corporation
    Inventors: Edwin J. Adlam, Sukianto Rusli, Jordan L. Wahl, Tayfun Ilercil, Robert A. Forcier, Jerome S. Sallo